IP Library Granted Patent US 9,166,158
Granted Patent B2
US 9,166,158 · App. 13/776,485 · Granted Oct 20, 2015

Apparatuses including electrodes having a conductive barrier material and methods of forming same

Inventors: Swapnil A. Lengade (Boise, ID); John M. Meldrim (Boise, ID); Andrea Gotti (Pozzo D'Adda, IT)
Assignee: Micron Technology, Inc.
H01L45/12H01L27/2427H01L27/2463H01L45/06H01L45/1233H01L45/144
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Quick Facts
Patent No.
US 9,166,158
App. No.
13/776,485
Granted
Oct 20, 2015
Kind
B2
Abstract

Apparatuses and methods of manufacture are disclosed for phase change memory cell electrodes having a conductive barrier material. In one example, an apparatus includes a first chalcogenide structure and a second chalcogenide structure stacked together with the first chalcogenide structure. A first electrode portion is coupled to the first chalcogenide structure, and a second electrode portion is coupled to the second chalcogenide structure. An electrically conductive barrier material is disposed between the first and second electrode portions.

Claims (24)

1. An apparatus, comprising:

a first chalcogenide structure, wherein the first chalcogenide structure comprises a switch;

a second chalcogenide structure stacked together with the first chalcogenide structure, wherein the second chalcogenide structure comprises a phase change memory storage element;

a first electrode portion coupled to the first chalcogenide structure;

a second electrode portion coupled to the second chalcogenide structure; and

an electrically conductive barrier material disposed between the first and second electrode portions.

2. The apparatus of claim 1 , wherein the electrically conductive barrier material comprises titanium nitride.

3. The apparatus of claim 1 , wherein the electrically conductive barrier material comprises tungsten silicide.

4. The apparatus of claim 1 , wherein the electrically conductive barrier material comprises silicon.

5. The apparatus of claim 4 , wherein the silicon is doped with boron.

6. The apparatus of claim 1 , wherein the first and second electrode portions comprise carbon.

7. The apparatus of claim 6 , wherein the electrically conductive barrier material is substantially not reactive to carbon.

8. The apparatus of claim 1 , wherein the first and second electrode portions comprise an electrically conductive and thermally insulative material.

9. The apparatus of claim 1 , wherein the first electrode portion is disposed between the first chalcogenide structure and the electrically conductive barrier material and the second electrode portion is disposed between the second chalcogenide structure and the electrically conductive barrier material.

10. A memory cell, comprising:

a phase change device configured to store one or more bits of data; and

a chalcogenide switch integrally formed in the memory cell with the phase change device and electrically coupled thereto through an electrode;

wherein the electrode comprises a first portion and a second portion separated by an electrically conductive barrier material.

11. The memory cell of claim 10 , wherein the electrically conductive barrier material is between approximately 5 and 50 angstroms in thickness.

12. The memory cell of claim 10 , wherein the electrically conductive barrier material is at least partially amorphous.

13. The memory cell of claim 10 , wherein the electrically conductive barrier material is at least partially crystalline.

14. The memory cell of claim 13 , wherein a grain boundary of the electrically conductive barrier material does not line up with a grain boundary of one of the phase change device or the switch.

15. The memory cell of claim 10 , wherein the first and second portions of the electrode are substantially not thermally conductive.

16. The memory cell of claim 15 , wherein the electrically conductive barrier material is thermally conductive.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2013
From: LENGADE, SWAPNIL A.; MELDRIM, JOHN M.; GOTTI, ANDREA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029871/0154 →
Continuity (1)
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