IP Library Granted Patent US 9,167,729
Granted Patent B2
US 9,167,729 · App. 14/012,659 · Granted Oct 20, 2015

Inverter, sealing air duct and heat dissipation system

Inventor: Xiaohu Liu (Shenzhen, CN)
Assignee: Huawei Technologies Co., Ltd.
H05K7/20909H02M7/003H05K7/209H05K7/20918
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Quick Facts
Patent No.
US 9,167,729
App. No.
14/012,659
Granted
Oct 20, 2015
Kind
B2
Abstract

An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

Claims (26)

1. An inverter, comprising:

an enclosure having a first cavity and a second cavity that are isolated from each other and sealed;

a magnetic conversion circuit comprising magnetic elements that are arranged in the first cavity;

a power conversion circuit comprising power tubes that are arranged in the second cavity;

a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity;

a sealing air duct arranged outside the second cavity,

wherein the sealing air duct comprises at least one columnar pipeline formed by a heat dissipation surface and a bottom surface,

wherein the at least one columnar pipeline is sealed at two ends,

wherein the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and

wherein the bottom surface comprises an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

2. The inverter according to claim 1 , wherein the heatsink comprises:

a first heatsink located outside the first cavity; and

a second heatsink located outside the second cavity,

wherein radiation fins of the first heatsink are isolated from radiation fins of the second heatsink.

3. The inverter according to claim 2 , wherein the magnetic conversion circuit is set to a substrate tightly adhering to the first heatsink, and wherein the power conversion circuit is set to a substrate tightly adhering to the second heatsink.

4. The inverter according to claim 1 , further comprising:

a first fan arranged inside the second cavity; and/or

a second fan arranged outside the enclosure.

5. The inverter according to claim 1 , further comprising a heat shield, wherein the heat shield is made of thermal insulation materials and is placed above the magnetic conversion circuit.

6. The inverter according to claim 1 , wherein the first cavity is located above, on the left side, on the right side, or in the middle of the second cavity.

7. The inverter according to claim 2 , wherein the sealing air duct is located on a lateral wall of the second cavity, or wherein the sealing air duct is arranged on the substrate of the second heatsink and is located on the left side, in the middle, or on the right side of the second heatsink.

8. The inverter according to claim 1 , wherein the cross-section of the heat dissipation surface comprises a boss shape, a sawtooth shape, or a ripple wave shape.

9. The inverter according to claim 1 , wherein the heat dissipation surface is formed at least in part by an alumina plate.

10. The inverter according to claim 2 , wherein the heat dissipation surface is sealingly connected to a lateral wall of the second cavity or the substrate of the second heatsink.

11. The inverter according to claim 1 , wherein the sealing air duct is sealed using at least one of a metal mechanical part sealing mode and a plastic parts sealing mode.

12. The inverter according to claim 1 , wherein the magnetic elements comprise a boost inductor or an inverter inductor, and wherein the power tubes comprise a boost power tube or an inverter power tube.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2021
From: HUAWEI TECHNOLOGIES CO., LTD.
To: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
Reel/Frame 058601/0734 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2013
From: LIU, XIAOHU
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 031111/0995 →
Priority Claims (1)
CN 2011 1 0316799 · Oct 18, 2011 · national
Continuity (2)
Continuation PCTCN2012075813 · May 21, 2012
Related Publication 20130343110A1 · Dec 26, 2013