IP Library Granted Patent US 9,184,083
Granted Patent B2
US 9,184,083 · App. 13/953,348 · Granted Nov 10, 2015

Apparatus, hybrid laminated body, method and materials for temporary substrate support

Inventors: Wayne S. Mahoney (St. Paul, MN); Rajdeep S. Kalgutkar (Woodbury, MN)
Assignee: 3M INNOVATIVE PROPERTIES COMPANY
H01L21/6836H01L21/304H01L21/6835H01L2221/6834H01L2221/68318H01L2221/68327H01L2221/68381H01L2221/68386Y10T428/31623
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Quick Facts
Patent No.
US 9,184,083
App. No.
13/953,348
Granted
Nov 10, 2015
Kind
B2
Abstract

A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

Claims (40)

1. A laminated body comprising:

a light-transmitting support;

a latent release layer disposed upon the light-transmitting support;

a joining layer disposed upon the latent release layer; and

a polyamide thermoplastic priming layer disposed upon the joining layer.

2. A laminate according to claim 1 , wherein said light-transmitting support comprises glass.

3. A laminate according to claim 1 , wherein the latent release layer comprises a photothermal conversion layer.

4. A laminate according to claim 2 , wherein the latent release layer is activated upon exposure to actinic radiation that is emitted from a laser or laser diode.

5. A laminate according to claim 3 , wherein the photothermal conversion layer comprises a light-absorbing agent and a heat decomposable resin disposed adjacent the joining layer.

6. A laminate according to claim 5 , wherein said light-absorbing agent comprises carbon black.

7. A laminate according to claim 1 , wherein the joining layer comprises a thermosetting adhesive.

8. A laminate according to claim 7 , wherein the thermosetting adhesive comprises an acrylic adhesive.

9. A laminate according to claim 1 , further comprising a substrate in contact with the polyamide thermoplastic priming layer.

10. A laminate according to claim 9 wherein the substrate comprises a substrate to be ground that is a silicon wafer.

11. A method for manufacturing a laminate according to claim 1 , the method comprising:

coating the polyamide thermoplastic priming layer onto the substrate;

optionally, drying the polyamide thermoplastic priming layer if the coating includes a solvent;

coating the joining layer onto the polyamide thermoplastic priming layer;

optionally, curing the joining layer;

coating the latent release layer upon the light-transmitting support; and

laminating the latent release layer to the joining layer.

12. A method for manufacturing a laminate according to claim 11 further comprising:

processing the substrate;

irradiating the photothermal conversion layer through the light-transmitting support to decompose the photothermal conversion layer and thereby to separate the substrate and the light-transmitting support;

peeling the joining layer from said substrate; and

removing the polyamide thermoplastic priming layer from the substrate.

13. A method for manufacturing a laminate according to claim 12 , wherein removing the polyamide thermoplastic priming layer comprises washing the polyamide thermoplastic priming layer with solvent.

14. A method for manufacturing a laminate according to claim 1 , the method comprising:

coating the polyamide thermoplastic priming layer onto the light-transmitting support;

optionally, drying the polyamide thermoplastic priming layer if the coating includes a solvent;

coating the joining layer onto the polyamide thermoplastic priming layer;

optionally, curing the joining layer;

coating the latent release layer upon the substrate; and

laminating the latent release layer to the joining layer.

15. A method for manufacturing a laminate according to claim 14 further comprising:

processing the substrate;

irradiating the photothermal conversion layer through the light-transmitting support to decompose the photothermal conversion layer and thereby to separate the substrate and the light-transmitting support;

peeling the joining layer from said substrate; and

removing the polyamide thermoplastic priming layer from the substrate.

16. A method for manufacturing a laminate according to claim 15 , wherein removing the polyamide thermoplastic priming layer comprises washing the polyamide thermoplastic priming layer with solvent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2013
From: MAHONEY, WAYNE S.; KALGUTKAR, RAJDEEP S.
To: 3M INNOVATIVE PROPERTIES COMPANY
Reel/Frame 031545/0672 →
Continuity (1)
Related Publication 20150031215A1 · Jan 29, 2015