Flexible organic light emitting display and method in an in-cell structure having a touch electrode array for manufacturing the same
Disclosed are an organic light emitting display that enables realization of a thin film shape and flexibility, and exhibits superior contact properties in touch pads based on an improved structure, and a method for manufacturing the same, wherein a distance between the outermost surface of the touch pad portion and the outermost surface of the dummy pad portion in the touch pad portion is smaller than the distance in a neighboring portion adjacent to the touch pad portion.
1. A method for manufacturing an organic light emitting display comprising:
forming a first etching stopper film and a first buffer layer having an active region and a dead region on a first substrate, forming a thin film transistor array including a thin film transistor in each of a plurality of pixels defined in a matrix form, an organic light emitting diode connected to each thin film transistor at each pixel, and a protective layer formed on the first buffer layer such that the protective layer covers the thin film transistor array and the organic light emitting diode, in the active region of the first buffer layer, and forming a dummy pad portion on the dead region of the first buffer layer;
forming a second etching stopper film and a second buffer layer having an active region and a dead region corresponding to the first buffer layer on a second substrate, forming a touch electrode array in the active region of the second buffer layer, forming a touch pad portion in a region corresponding to the dummy pad portion; and
applying a sealant including conductive balls to the touch pad portion or the dummy pad portion;
joining the touch electrode array to the protective layer,
wherein a distance between the outermost surface of the touch pad portion and the outermost surface of the dummy pad portion in the touch pad portion is smaller than the distance in a neighboring portion adjacent to the touch pad portion.
2. The method according to claim 1 , wherein, after the joining, the conductive balls are compressed to a predetermined thickness between the touch pad portion and the dummy pad portion.
3. The method according to claim 2 , wherein after the joining, the neighboring portion adjacent to the touch pad portion and a neighboring portion adjacent to the dummy pad portion are spaced from the sealant by a predetermined distance, respectively.
4. The method according to claim 1 , further comprising:
removing the first substrate and the second substrate; and
attaching a film substrate to an exposed surface of the first etching stopper film.
5. The method according to claim 4 , wherein the removing the first substrate and the second substrate is carried out by etching or laser-irradiating the first substrate and the second substrate.