IP Library Granted Patent US 9,184,448
Granted Patent B2
US 9,184,448 · App. 13/363,694 · Granted Nov 10, 2015

Method of producing aluminum structure and aluminum structure

Inventors: Kotaro Kimura (Osaka, JP); Akihisa Hosoe (Osaka, JP); Takayasu Sugihara (Osaka, JP); Osamu Ohama (Osaka, JP); Kazuki Okuno (Itami, JP); Tomoyuki Awazu (Itami, JP); Koji Nitta (Osaka, JP)
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
H01M4/808C25D1/08C25D3/66C25D5/56C25D11/04H01G11/30H01G11/68H01G11/70H01G11/86H01M4/661Y02E60/13Y10T428/12479
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,184,448
App. No.
13/363,694
Granted
Nov 10, 2015
Kind
B2
Abstract

Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body.

Claims (10)

1. A method of producing an aluminum structure comprising:

a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane; and

a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 380° C. and lower than 660° C. to decompose the resin molded body,

wherein the step of preparing an aluminum-coated resin molded body includes a conductivity-imparting step in which electrical conductivity is imparted to the surface of the resin molded body and a step of forming the aluminum layer by performing aluminum plating in a molten salt, and

the thickness of the aluminum layer is 1 to 100 μm.

2. The method of producing an aluminum structure according to claim 1 , wherein, in the heat treatment step, heat treatment is performed at a temperature equal to or higher than 380° C. and lower than 500° C.

3. The method of producing an aluminum structure according to claim 1 , wherein the resin molded body is a resin porous body having a three-dimensional network structure.

4. The method of producing an aluminum structure according to claim 1 , further comprising, after the heat treatment step, a solvent treatment step in which the aluminum structure is brought into contact with an organic solvent to remove a decomposition product of the resin molded body.

5. The method of producing an aluminum structure according to claim 1 , wherein the heat treatment step is performed in an inert gas atmosphere.

6. The method of producing an aluminum structure according to claim 1 , wherein the conductivity-imparting step is a step of attaching aluminum to the surface of the resin molded body by a vapor-phase method.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2012
From: KIMURA, KOTARO; HOSOE, AKIHISA; SUGIHARA, TAKAYASU; OHAMA, OSAMU; OKUNO, KAZUKI; AWAZU, TOMOYUKI; NITTA, KOJI
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 027969/0282 →
Priority Claims (1)
JP 2010-206243 · Sep 15, 2010 · national
Continuity (2)
Continuation PCTJP2011070464 · Sep 8, 2011
Related Publication 20120183804A1 · Jul 19, 2012