Camera module, manufacturing apparatus, and manufacturing method
A camera module includes an imaging sensor, a conductive member, a plate-like member, and a sealing member. The imaging sensor includes a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and a drive section driving the lens. The conductive member is connected to the drive section for supply of power to the drive section. The plate-like member is provided with the imaging sensor and the conductive member. The sealing member is formed by sealing the imaging sensor and the conductive member, the conductive member being exposed at a connection part for connection to the drive section, the imaging sensor being exposed at the light-receiving surface.
1. A camera module, comprising:
an imaging sensor including a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including an aperture to receive the light, a lens and an actuator to drive the lens;
a conductive member configured to connect to terminals of the actuator to supply power to the actuator, the terminals of the actuator being located at a bottom surface of the lens unit that is opposite a surface of the lens unit that includes the aperture, the terminals of the actuator extending in a direction opposite from the surface of the lens unit that includes the aperture;
a plate member provided with the imaging sensor and the conductive member;
a sealing member formed by sealing the imaging sensor and the conductive member, wherein the sealing member seals at least a side surface of the imaging sensor,
the conductive member being exposed at a connection part for connection to the terminals of the actuator, the imaging sensor being exposed at the light-receiving surface; and
a transmissive member disposed directly on the light-receiving surface of the imaging sensor and configured to cover the light-receiving surface of the imaging sensor, the transmissive member passing the light from the lens unit.
2. The camera module according to claim 1 , wherein the plate member is provided with the lens unit to cover the imaging sensor, and the connection part and the light-receiving surface are exposed from a surface of the sealing member opposing the lens unit.
3. The camera module according to claim 1 , wherein the sealing member is formed by sealing the imaging sensor and the conductive member in a state where the connection part and the light-receiving surface are exposed, the light-receiving surface being covered by the transmissive member.
4. The camera module according to claim 1 , wherein the imaging sensor is electrically connected to the plate member by at least one of a through electrode and an adhesion electrode, the through electrode being formed by going through the imaging sensor, the adhesion electrode being formed by adhering to the imaging sensor.
5. The camera module according to claim 1 , wherein the sealing member is a light-shielding resin.
6. The camera module according to claim 1 , further comprising:
an infrared light cutting filter disposed between the bottom surface of the lens unit and the light receiving surface of the imaging sensor.
7. A manufacturing apparatus, comprising:
circuitry configured to
provide a conductive member to a plate member including an imaging sensor, the imaging sensor including a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and an actuator to drive the lens, the conductive member being connected to terminals of the actuator to supply power to the actuator, the terminals of the actuator being located at a bottom surface of the lens unit that is opposite a surface of the lens unit including an aperture to receive the light, the terminals of the actuator extending in a direction opposite from the surface of the lens unit that includes the aperture,
provide a transmissive member disposed directly on the light-receiving surface of the imaging sensor and configured to cover the light-receiving surface of the imaging sensor, the transmissive member passing the light from the lens unit; and
seal the conductive member and at least a side surface of the imaging sensor,
the conductive member being exposed at a connection part to connect to the actuator, the imaging sensor being exposed at the light-receiving surface.
8. A method of manufacturing a camera module by a manufacturing apparatus, comprising:
providing, by a manufacturing apparatus, a conductive member to a plate member including an imaging sensor, the imaging sensor including a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and an actuator to drive the lens, the conductive member being connected to terminals of the actuator to supply power to the actuator, the terminals of the actuator being located at a bottom surface of the lens unit that is opposite a surface of the lens unit including an aperture to receive the light, the terminals of the actuator extending in a direction opposite from the surface of the lens unit that includes the aperture;
providing, by the manufacturing apparatus, a transmissive member disposed directly on the light-receiving surface of the imaging sensor and configured to cover the light-receiving surface of the imaging sensor, the transmissive member passing the light from the lens unit; and
sealing, by the manufacturing apparatus, the conductive member and at least a side surface of the imaging sensor,
the conductive member being exposed at a connection part to connect to the terminals of the actuator, the imaging sensor being exposed at the light-receiving surface.