Thermal management in optical and electronic devices
A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.
1. An electronic device, comprising:
one or more heat generating electrical components; and
a thermal management system, comprising:
a heat sink in thermal communication with the one or more heat generating electrical components;
a stack assembly comprising:
a plurality of synthetic jet diaphragms; and
a plurality of spacers, wherein each pair of synthetic jet diaphragms is separated by a respective spacer of the plurality of spacers to form a respective synthetic jet and wherein each spacer comprises an opening through which air is expelled during operation of the synthetic jet diaphragms,
wherein a plurality of synthetic jets are defined by the plurality of synthetic jet diaphragms and the plurality of spacers such that each synthetic jet comprises a respective upper diaphragm and a respective lower diaphragm separated by a respective spacer and wherein each synthetic jet shares at least one diaphragm with an adjacent diaphragm.
2. The electronic device of claim 1 , wherein the stack assembly further comprises a holder component in which the plurality of synthetic jets diaphragms and the plurality of spacers are positioned.
3. The electronic device of claim 2 , comprising:
at least one clamping plate configured to engage with one or more engagement features of the holder component; and
an compressible ring positioned between at least one clamping plate and the stack assembly.
4. The electronic device of claim 1 , wherein the one or more heat generating components comprise a light source.
5. The electronic device of claim 1 , wherein the heat sink comprises one or more cooling fins and wherein the respective openings of the one or more spacers are positioned so as cause air to flow over the one or more cooling fins.
6. The electronic device of claim 1 , wherein the thermal management system comprises one or more ventilation slots or holes through which air moves when the plurality of synthetic jet diaphragms operate.
7. The electronic device of claim 1 , comprising a thermal interface structure positioned between the one or more heat generating electrical components and the heat sink.
8. The electronic device of claim 1 , wherein each synthetic jet diaphragm has a diameter less than 25 mm.
9. The electronic device of claim 1 , wherein the stack assembly is positioned within a screw-in base of the electronic device.