Power up of semiconductor device having a temperature circuit and method therefor
View Patent ↗A semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at other operating temperatures. The temperature sensing circuit may provide a plurality of temperature ranges for setting the operational parameters. Each temperature range can include a temperature range upper limit value and a temperature range lower limit value and adjacent temperature ranges may overlap. The temperature ranges may be set in accordance with a count value that can incrementally change in response to the at least one temperature sensing circuit.
1. A method of operating a device, comprising the steps of:
transitioning a power supply from a first potential to a second potential;
generating a first power up signal in response to the power supply potential transition;
initializing a counter circuit to provide a predetermined count value in response to the first power up signal;
incrementally changing the count value in response to an output signal provided by a first temperature sensor circuit;
generating a second power up signal in response to the power supply potential transition;
generating a load signal in response to the second power up signal; and
providing performance parameters from a performance parameter table based on the count value in response to the load signal.
2. The method of operating the device of claim 1 , further including the step of:
latching the performance parameters to provide latched performance parameters.
3. The method of operating the device of claim 1 , further including the step of:
adjusting operational aspects of performance parameter adjusted circuits in response to the values of the latched performance parameters.
4. The method of operating the device of claim 1 , wherein:
the device is a semiconductor device.
5. A method of operating a device having a temperature circuit that provides a temperature window comprising the steps of:
initializing the temperature circuit to provide a first temperature window in response to transitioning a power supply from a first potential to a second potential wherein the device has a device temperature that is outside the first temperature window; and
adjusting the temperature circuit to provide a second temperature window that includes the device temperature.
6. The method of claim 5 , wherein:
the step of adjusting includes incrementally changing a count value provided by a counter circuit.
7. The method of claim 6 , further including the step of:
providing performance parameters from a performance parameter table based on the count value provided by the counter circuit after the step of adjusting the temperature circuit.
8. The method of claim 7 , further including the step of:
generating a read signal after the step of adjusting the temperature circuit and the performance parameter table provides the performance parameters in response to the read signal.
9. The method of claim 8 , further including the steps of:
generating a load signal after the step of generating the read signal; and
latching the performance parameters to provide latched performance parameters in response to the load signal.
10. A device, comprising:
power up circuit providing a first power up signal in response to a power supply transitioning from a first potential to a second potential;
a temperature circuit coupled to receive the first power up signal, the temperature circuit providing a first upper temperature limit value and a first lower temperature limit value in response to the first power up signal
wherein the device has a device temperature outside the first upper temperature limit value and the first lower temperature limit value.
11. The device of claim 10 , further including:
a counter circuit coupled to receive the first power up signal, the counter circuit provides a count value having a predetermined value in response to the first power up signal wherein
the temperature circuit is coupled to receive the predetermined count value, the temperature circuit provides the first upper temperature limit value and the first lower temperature limit value in response to the predetermined count value.
12. The device of claim 11 , further including:
the power up circuit provides a second power up signal; and
a performance parameter table coupled to provide performance parameters in response to the second power up signal.
13. The device of claim 12 , further including:
a control circuit coupled to receive the second power up signal and provide a read signal wherein the performance parameter table provides the performance parameters in response to the read signal.
14. The device of claim 13 , further including:
the control circuit provides a load signal; and
latch circuits coupled to receive the performance parameters and the load signal and provide latched performance parameters.
15. The device of claim 14 , further including:
performance parameter adjusted circuits coupled to receive the latched performance parameters, performance parameter adjusted circuits have operational aspects adjusted in response to the values of the latched performance parameters.
16. The device of claim 15 , further including:
the performance parameter table is a non-volatile memory.
17. The device of claim 10 , wherein:
the temperature circuit is disabled in response to the first power up signal.
18. The device of claim 10 , wherein:
the device is a semiconductor device.