IP Library Granted Patent US 9,196,478
Granted Patent B2
US 9,196,478 · App. 14/268,053 · Granted Nov 24, 2015

Graphene transferring methods, device manufacturing method using the same, and substrate structures including graphene

Inventors: Joo-ho Lee (Hwaseong-si, KR); Yong-sung Kim (Namyangju-si, KR); Chang-youl Moon (Suwon-si, KR); Sung-hee Lee (Suwon-si, KR); Chang-seung Lee (Yongin-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01L21/02527H01L21/0237H01L21/0262H01L21/02488H01L21/02491H01L21/02502H01L21/02521H01L21/2007H01L29/1606H01L29/66015
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Quick Facts
Patent No.
US 9,196,478
App. No.
14/268,053
Granted
Nov 24, 2015
Kind
B2
Abstract

Graphene transferring methods, a device manufacturing method using the same, and substrate structures including graphene, include forming a catalyst layer on a first substrate, forming a graphene layer on the catalyst layer, forming a protection metal layer on the graphene layer, attaching a supporter to the protection metal layer, separating the first substrate from the catalyst layer such that the protection metal layer, the graphene layer, and the catalyst layer remain on the supporter, removing the catalyst layer from the supporter, and transferring the protection metal layer and the graphene layer from the supporter to a second substrate.

Claims (47)

1. A graphene transfer method, comprising:

forming a catalyst layer on a first substrate;

forming a graphene layer on the catalyst layer;

forming a protection metal layer on the graphene layer;

attaching a supporter to the protection metal layer;

separating the first substrate from the catalyst layer such that the protection metal layer, the graphene layer, and the catalyst layer remain on the supporter;

removing the catalyst layer from the supporter; and

transferring the protection metal layer and the graphene layer from the supporter to a second substrate.

2. The graphene transfer method of claim 1 , wherein

a size of the protection metal layer is smaller than a size of the graphene layer, and

an outer portion of the graphene layer is exposed by the protection metal layer.

3. The graphene transfer method of claim 2 , wherein the attaching of the supporter to the protection metal layer includes bonding the outer portion of the graphene layer to the supporter.

4. The graphene transfer method of claim 2 , further comprising:

removing the outer portion of the graphene layer exposed by the protection metal layer such that a portion of the catalyst layer is exposed, after the forming of the protection metal layer and prior to the attaching of the supporter to the protection metal layer, and

wherein the attaching of the supporter to the protection metal layer includes bonding the exposed portion of the catalyst layer to the supporter.

5. The graphene transfer method of claim 1 , wherein the protection metal layer includes at least one of Au, Cu, Ni, Ti, Fe, Ru, Pd, Al and combinations thereof.

6. The graphene transfer method of claim 1 , wherein the forming of the protection metal layer includes performing an evaporation process.

7. The graphene transfer method of claim 1 , further comprising:

providing an insulating layer between the first substrate and the catalyst layer,

wherein the separating of the first substrate includes separating the catalyst layer and the insulating layer from each other.

8. The graphene transfer method of claim 1 , further comprising:

providing an insulating layer between the first substrate and the catalyst layer,

wherein the separating of the first substrate includes removing at least a portion of the insulating layer.

9. The graphene transfer method of claim 1 , wherein a size of the supporter is greater than a size of the first substrate.

10. The graphene transfer method of claim 9 , further comprising:

providing a fixing member configured to attach to an outer portion of the supporter.

11. The graphene transfer method of claim 1 , wherein the transferring of the protection metal layer and the graphene layer from the supporter to the second substrate includes,

attaching the second substrate to the graphene layer; and

removing the supporter from the protection metal layer.

12. The graphene transfer method of claim 11 , wherein the attaching of the second substrate to the graphene layer includes,

providing deionized water between the graphene layer and the second substrate;

bonding the graphene layer and the second substrate having the deionized water interposed therebetween; and

drying the graphene layer and the second substrate.

13. The graphene transfer method of claim 1 , wherein at least one of the first substrate and the second substrate is a wafer level substrate.

14. A method of manufacturing a graphene applied device, the method comprising:

transferring the graphene layer and the protection metal layer from the first substrate to the second substrate according to the method of claim 1 ; and

forming the graphene applied device such that the graphene layer on the second substrate is incorporated into the graphene applied device.

15. The method of claim 14 , wherein the forming of the graphene applied device includes forming at least one electrode from the protection metal layer.

16. The method of claim 14 , wherein the graphene applied device includes a transistor.

17. A graphene transfer method, comprising:

forming a thin film including a graphene layer on a first substrate;

forming a protection layer having a size smaller than a size of the graphene layer on the thin film such that a portion of the thin film around the protection layer is exposed;

attaching a supporter to the protection layer and the exposed portion of the thin film;

separating the first substrate from the thin film such that the protection layer and the thin film remain on the supporter; and

transferring the graphene layer from the supporter to a second substrate.

18. The graphene transfer method of claim 17 , wherein the thin film further includes a catalyst layer provided between the first substrate and the graphene layer.

19. The graphene transfer method of claim 18 , wherein the attaching of the supporter to the protection layer and the exposed portion of the thin film includes bonding at least one of the graphene layer and the catalyst layer to the supporter.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2015
From: LEE, JOO-HO; KIM, YONG-SUNG; MOON, CHANG-YOUL; LEE, SUNG-HEE; LEE, CHANG-SEUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 035735/0318 →
Priority Claims (1)
KR 10-2013-0051500 · May 7, 2013 · national
Continuity (1)
Related Publication 20140335681A1 · Nov 13, 2014