Light emitting device package and light unit
Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
1. A light emitting device package comprising:
a housing having a through-hole;
a heat sink portion in the through-hole, wherein the heat sink portion includes an alloy layer; and
a light emitting device on the heat sink portion.
2. The light emitting device package according to claim 1 , wherein the light emitting device is directly disposed on the alloy layer.
3. The light emitting device package according to claim 1 , wherein the alloy layer includes at least one of W, Cu or Mo.
4. The light emitting device package according to claim 1 , wherein the heat sink portion comprises an alloy layer having CuW or CuMo and a copper layer under the alloy layer.
5. The light emitting device package according to claim 1 , wherein the through-hole is formed in a bottom surface of the housing.
6. The light emitting device package according to claim 1 , wherein the heat sink portion includes a first heat sink portion and a second heat sink portion.
7. The light emitting device package according to claim 6 , wherein a portion of the housing is disposed between the first heat sink portion and the second heat sink portion.
8. The light emitting device package according to claim 1 , wherein a width of the heat sink portion increases with increasing distance from the light emitting device.
9. The light emitting device package according to claim 1 , wherein a width of the heat sink portion increases with decreasing distance from the light emitting device.
10. A light emitting device package comprising:
a package body having a through-hole;
a radiator disposed in the through-hole, wherein the radiator includes an alloy layer having Cu; and
a light emitting device disposed on the radiator.
11. The light emitting device package according to claim 10 , wherein the alloy layer includes at least one of W or Mo.
12. The light emitting device package according to claim 10 , wherein the alloy layer comprises CuW or CuMo and a copper layer under the alloy layer.
13. The light emitting device package according to claim 10 , wherein the package body includes at least one of Si x O y , Si x N y , Al 2 O 3 , or AlN.
14. The light emitting device package according to claim 10 , wherein the radiator comprises a first radiator and a second radiator.
15. The light emitting device package according to claim 14 , wherein a portion of the package body is disposed between the first radiator and the second radiator.
16. A light emitting device package comprising:
a package body a through-hole;
a radiator in the through-hole;
an anti-bulging layer on the radiator; and
a light emitting device on the anti-bulging layer.
17. The light emitting device package according to claim 16 , wherein the anti-bulging layer comprises an electrode pattern electrically connected to the light emitting device.
18. The light emitting device package according to claim 16 , wherein the radiator is exposed outside from a lower surface of the package body and,
wherein the through-hole is formed in a bottom surface of the package body.
19. The light emitting device package according to claim 1 , wherein the housing includes a cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface of the cavity.
20. The light emitting device package according to claim 10 , wherein the package body includes an anti-bulging layer disposed between the light emitting device and the radiator.