Integrated circuit package with die attach paddle having at least one recessed portion

1. An integrated circuit package comprising:

a die attach paddle;

a power die mounted on said die attach paddle; and

a controller die mounted on said die attach paddle;

wherein said die attach paddle comprises at least two middle channels underlying middle portions of said controller die and a plurality of peripheral channels at least partially underlying peripheral portions of said controller die.

2. The integrated circuit package of claim 1 further comprising a layer of nonconductive die attach film connecting said controller die to underlying surface portions of said die attach paddle.

3. The integrated circuit package of claim 2 further comprising a layer conductive adhesive connecting said power die to said die attach paddle.

4. An integrated circuit package comprising:

a die attach paddle comprising a plurality of half etched channels in said die attach paddle underlying said controller die and defining a plurality of paddle islands;

a power die mounted on said die attach paddle; and

a controller die mounted on said die attach paddle, said controller die being attached to said paddle islands by a layer of nonconductive die attach material, and

wherein said power die is attached to said die attach paddle by a layer of conductive die attach material.

5. The integrated circuit package of claim 4 , said plurality of half etched channels in said die attach paddle below said controller die being filled with mold compound.

6. The integrated circuit package of claim 5 further comprising a plurality of leadframe lead portions positioned around said die attach paddle, at least one of said plurality of lead portions being electrically connected to said power die and at least one of said plurality of lead portions being electrically connected to said controller die, and wherein said die attach paddle and said lead portions and said power die and said controller die are encased in mold compound.