Display device using semiconductor light emitting device
Discussed is a display device including a substrate having at least one of a first and a second electrode, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first and second electrode, wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate.
1. A display device, comprising:
a wiring substrate having at least one of a first electrode and a second electrode;
a conductive adhesive layer configured to cover the wiring substrate; and
a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode,
wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate, and
wherein a boundary portion between the first conductive adhesive layer and the second conductive adhesive layer is formed between at least part of the plurality of semiconductor light emitting devices.
2. The display device of claim 1 , wherein the plurality of semiconductor light emitting devices are disposed along a plurality of rows, and
wherein the boundary portion is formed in parallel to the rows between at least part of the plurality of rows.
3. The display device of claim 2 , wherein the first electrode and the second electrode are formed with a plurality of lines, respectively, and either one of a plurality of lines of the first electrode and a plurality of lines of the second electrode are arranged along the plurality of rows.
4. The display device of claim 1 , wherein the boundary portion has a first boundary portion and a second boundary portion formed on the first conductive adhesive layer and the second conductive adhesive layer, respectively, and the first boundary portion and the second boundary portion are in contact with each other between the plurality of semiconductor light emitting devices.
5. The display device of claim 1 , wherein the conductive adhesive layer comprises a plurality of anisotropic conductive films (ACFs) coupled to the substrate.
6. The display device of claim 1 , wherein at least part of the plurality of semiconductor light emitting devices are buried in the conductive adhesive layer, and the conductive adhesive layer has a non-transparent resin to block light from being transmitted through a boundary portion between the first conductive adhesive layer and the second conductive adhesive layer.
7. The display device of claim 6 , wherein the non-transparent resin comprises a black or white resin.
8. The display device of claim 1 , wherein the wiring substrate is any one of flexible polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET) substrates.
9. The display device of claim 1 , wherein each of the plurality of regions has a length and a width that are different from each other.
10. The display device of claim 1 , wherein each of the plurality of semiconductor light emitting devices emits light of at least one of red light, green light, blue light and ultraviolet light.
11. The display device of claim 1 , further comprising a phosphor layer to convert a predetermined light into at least one of red light, green light and blue light.
12. The display device of claim 1 , wherein the plurality of regions are disposed along the arrangement of the first electrode or disposed along the arrangement direction of the second electrode.
13. A display device, comprising:
a wiring substrate having at least one of a first electrode and a second electrode;
a conductive adhesive layer configured to cover the wiring substrate; and
a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode,
wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate,
wherein the conductive adhesive layer comprises a plurality of anisotropic conductive films (ACFs) coupled to the substrate,
wherein the plurality of anisotropic conductive films have a first anisotropic conductive film and a second anisotropic conductive film corresponding to the first conductive adhesive layer and the second conductive adhesive layer, and
wherein boundary portions between the first and the second anisotropic conductive film are in contact with each other according to deformation due to thermal compression.
14. The display device of claim 13 , wherein the boundary portions are in contact with each other as resin flows due to the thermal compression to fill a space between the plurality of anisotropic conductive films.
15. A display device, comprising:
a wiring substrate having at least one of a first electrode and a second electrode;
a conductive adhesive layer configured to cover the wiring substrate; and
a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode,
wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate,
wherein the conductive adhesive layer comprises a single anisotropic conductive film (ACF) coupled to the substrate, and
wherein the first conductive adhesive layer and the second conductive adhesive layer are partitioned by a through hole passing through the single anisotropic conductive film.
16. The display device of claim 15 , wherein the through hole is formed in an elongated manner in one direction to form a line.
17. A display device, comprising:
a wiring substrate having at least one of a first electrode and a second electrode;
a conductive adhesive layer configured to cover the wiring substrate; and
a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode,
wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate,
wherein a phosphor layer is formed on one surface of the semiconductor light emitting devices, and the phosphor layer has a black matrix located between each phosphor, and
wherein the first conductive adhesive layer and the second conductive adhesive layer are partitioned at a location corresponding to the black matrix.
18. The display device of claim 17 , wherein a boundary portion between the first conductive adhesive layer and the second conductive adhesive layer is covered by the black matrix.
19. A method of fabricating a display device, the method comprising:
forming a plurality of conductive adhesive layers on a first substrate containing an electrode;
allowing a second substrate disposed with a plurality of semiconductor light emitting devices to be disposed such that the electrode faces the semiconductor light emitting devices;
thermally compressing the first substrate to the second substrate to couple the semiconductor light emitting device to the plurality of conductive adhesive layers; and
removing the second substrate,
wherein the plurality of conductive adhesive layers are disposed to be separated from each other to have a space that can be expanded during the thermal compression.
20. The method of claim 19 , wherein the space is filled by the expansion of the plurality of conductive adhesive layers due to the thermal compression to allow the boundary portions of the plurality of conductive adhesive layers to be contact with each other.