IP Library › Granted Patent US 9,212,942
Granted Patent B2
US 9,212,942 · App. 13/934,345 · Granted Dec 15, 2015

Waveguide coupling, high-frequency module, fill-level radar and use

Inventors: Christian Weinzierle (Wolfach, DE); Daniel Schultheiss (Hornberg, DE)
Assignee: VEGA Grieshaber KG
G01F23/284H01P5/024H01P5/08H01P5/107H01Q13/02
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Quick Facts
Patent No.
US 9,212,942
App. No.
13/934,345
Granted
Dec 15, 2015
Kind
B2
Abstract

A waveguide coupling includes a planar radiator element which couples the transmission signal into a waveguide of the waveguide coupling. The waveguide widens in the direction of the planar radiator element, in such a way that the radiator element can be of a comparatively large diameter without the inner walling of the waveguide detracting significantly from the signal quality.

Claims (26)

1. A waveguide coupling for coupling an electromagnetic signal from a high-frequency module into a waveguide, comprising:

a planar radiator element arranged on a circuit board and configured to emit the signal;

a housing including a rear wall and a waveguide leading through the rear wall, the waveguide being configured to transmit the emitted signal from a volume defined by a start region of the waveguide along a volume defined by a main region of the waveguide; and

a dielectric sealing element positioned in the waveguide,

wherein the planar radiator element is one of (a) arranged in the start region and (b) arranged immediately upstream from the start region;

wherein an internal diameter of the start region in a transition region to the main region is the same as an internal diameter of the main region, and becomes larger towards the planar radiator element; and

wherein the circuit board is attached to the housing, such that it closes the housing,

wherein the circuit board, the housing, the waveguide, and the dielectric sealing element form an internal cavity inside the housing, which is sealed off from the environment by the circuit board and the dielectric sealing element in a gas-tight manner.

2. The waveguide coupling according to claim 1 , wherein the main region is arranged at a distance from the planar radiator element in the radiation direction of the signal.

3. The waveguide coupling according to claim 1 , wherein an inside of the start region follows a conical progression.

4. The waveguide coupling according to claim 1 , wherein an inside of the start region follows a hyperbolic progression.

5. The waveguide coupling according to claim 1 , wherein an inside of the start region follows a stepped progression.

6. The waveguide coupling according to claim 1 , wherein a diameter of the planar radiator element is greater than an internal diameter of the main region.

7. The waveguide coupling according to claim 1 , wherein the waveguide includes an internal, peripheral web on which the dielectric sealing element is laid.

8. The waveguide coupling according to claim 1 , wherein the dielectric sealing element is arranged in the start region.

9. The waveguide coupling according to claim 1 , wherein a diameter of the planar radiator element is less than half of a maximum internal diameter of the start region.

10. The waveguide coupling according to claim 1 , wherein a diameter of the planar radiator element is less than third of a maximum internal diameter of the start region.

11. The waveguide coupling according to claim 1 wherein the housing is connected in a gas-tight manner to the circuit board.

12. The waveguide coupling according to claim 11 , wherein the waveguide includes an external, peripheral web on which the circuit board is laid.

13. A high-frequency module for generating a measurement signal for a fill-level measurement device, comprising

a waveguide coupling according to claim 1 .

14. A fill-level radar, comprising:

a high-frequency module generating a measuring signal and including a waveguide coupling according to claim 1 .

15. A field device, comprising;

a waveguide coupling according to claim 1 .

16. The waveguide coupling according to claim 1 , wherein the planar radiator element is arranged on the side of the circuit board which faces the internal cavity.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2015
From: WEINZIERLE, CHRISTIAN; SCHULTHEISS, DANIEL
To: VEGA GRIESHABER KG
Reel/Frame 037022/0146 →
Priority Claims (2)
EP 12 175 004 · Jul 4, 2012 · regional
EP 12 175 007 · Jul 4, 2012 · regional
Continuity (3)
Provisional Application 61668154 · Jul 5, 2012
Provisional Application 61668161 · Jul 5, 2012
Related Publication 20140009323A1 · Jan 9, 2014