Method of making nanostructure
A method for making nanostructure is provided. The method includes following steps. A conductive layer including a graphene film is applied on an insulating substrate. A resist layer is placed on the conductive layer. A number of openings are formed by patterning the resist layer via electron beam lithography. A part of the conductive layer is exposed to form a first exposed portion through the plurality of openings. The first exposed portion of the conductive layer is removed to expose a part of the insulting substrate to form a second exposed portion. A preform layer is introduced on the second exposed portion of the insulating substrate. Remaining resist layer and remaining conductive layer are eliminated. A number of nanostructures are formed.
1. A method for making nanostructure comprising:
applying a conductive layer on an insulating substrate, wherein the conductive layer comprises a graphene film;
placing a resist layer on the conductive layer;
forming a plurality of openings by patterning the resist layer via electron beam lithography, wherein a part of the conductive layer is exposed through the plurality of openings to form a first exposed portion;
removing the first exposed portion of the conductive layer to expose a part of the insulting substrate to form a second exposed portion;
introducing a preform layer on the second exposed portion of the insulating substrate; and
eliminating remaining resist layer and remaining conductive layer, and forming a plurality of nanostructures, wherein the remaining resist layer is a residual part of the resist layer after being patterned via electron beam lithography, the remaining conductive layer is a residual part of the conductive layer after removing the first exposed portion of the conductive layer, and each of the plurality of nanostructures is a protrusion.
2. The method of claim 1 , wherein a resolution of the plurality of nanostructures is in a range from about 20 nanometers to about 100 nanometers.
3. The method of claim 2 , wherein a resolution of the plurality of nanostructures is in a range from about 20 nanometers to about 40 nanometers.
4. The method of claim 1 , wherein the applying the conductive layer on the insulating substrate comprises following sub-steps:
placing a metal substrate in a reacting chamber;
supplying a carbon source gas and a hydrogen gas into the reacting chamber, thereby forming a graphene film on the metal substrate, wherein a ratio between flow rates of the carbon source gas and the hydrogen gas is in a range from about 3:1, a temperature in the reacting chamber is in a range from about 800° C. to about 1100° C. with a constant temperature period in a range from about 5 minutes to about 30 minutes, and a pressure in the reacting chamber is in a range from about 66.7 Pa to about 10 5 Pa; and
transferring the graphene film from the metal substrate on the insulating substrate.
5. The method of claim 1 , wherein the graphene film comprises a single-layer graphene.
6. The method of claim 1 , wherein the removing the first exposed portion of the conductive layer is performed by a method of plasma etching or reactive ion etching.
7. The method of claim 1 , wherein the eliminating the remaining conductive layer comprises laser ablation, reactive ion etching, heating, or ultrasonic washing in water.
8. The method of claim 1 , wherein a pattern of the plurality of nanostructure is the same as a pattern of the plurality of openings.
9. The method of claim 1 , wherein the insulating substrate comprises a material that is selected from the group consisting of polycarbonate, polymethyl methacrylate acrylic, polyethylene terephthalate, polyethersulfone, cellulose ester, polyvinyl chloride, benzocyclobutenes, acrylic resins, acrylonitrile butadiene styrene polyamide, and combinations thereof.
10. A method for making nanostructure comprising:
applying a conductive layer on an insulating substrate, wherein the conductive layer comprises a graphene film;
placing a resist layer on the conductive layer;
forming a plurality of openings by patterning the resist layer via electron beam lithography, wherein a part of the conductive layer is exposed through the plurality of openings to form a first exposed portion;
removing the first exposed portion of the conductive layer to expose a part of the insulting substrate to form a second exposed portion;
etching the second exposed portion of the insulting substrate, and forming a plurality of nanostructures, wherein each of the plurality of nanostructures is a concave; and
eliminating remaining resist layer and remaining conductive layer, wherein the remaining resist layer is a residual part of the resist layer after being patterned via electron beam lithography, and the remaining conductive layer is a residual part of the conductive layer after removing the first exposed portion of the conductive layer.
11. The method of claim 10 , wherein a resolution of the plurality of nanostructures is in a range from about 20 nanometers to about 100 nanometers.
12. The method of claim 10 , wherein a resolution of the plurality of nanostructures is in a range from about 20 nanometers to about 40 nanometers.
13. The method of claim 10 , wherein the applying the conductive layer on the insulating substrate comprises following sub-steps:
placing a metal substrate in a reacting chamber;
supplying a carbon source gas and a hydrogen gas into the reacting chamber, thereby forming a graphene film on the metal substrate, wherein a ratio between flow rates of the carbon source gas and the hydrogen gas is in a range from about 3:1, a temperature in the reacting chamber is in a range from about 800° C. to about 1100° C. with a constant temperature period in a range from about 5 minutes to about 30 minutes, and a pressure in the reacting chamber is in a range from about 66.7 Pa to about 10 5 Pa; and
transferring the graphene film from the metal substrate on the insulating substrate.
14. The method of claim 10 , wherein the graphene film comprises a single-layer graphene.
15. The method of claim 10 , wherein the etching the second exposed portion of the insulting substrate comprises a method of plasma etching or reactive ion etching.
16. The method of claim 10 , wherein the removing the remaining conductive layer comprises laser ablation, reactive ion etching, heating, or ultrasonic washing in water.
17. A method for making nanostructure comprising:
applying a conductive layer on an insulating substrate, wherein the conductive layer comprises a graphene film;
placing a resist layer on the conductive layer; and
forming a plurality of openings by patterning the resist layer via electron beam lithography, wherein a part of the conductive layer is exposed through the plurality of openings.
18. The method of claim 17 , wherein a resolution of the plurality of openings is in a range from about 20 nanometers to about 100 nanometers.
19. The method of claim 17 , wherein a resolution of the plurality of openings is in a range from about 20 nanometers to about 40 nanometers.
20. The method of claim 17 , wherein the applying the conductive layer on the insulating substrate comprises following sub-steps:
placing a metal substrate in a reacting chamber;
supplying a carbon source gas and a hydrogen gas into the reacting chamber, thereby forming a graphene film on the metal substrate, wherein a ratio between flow rates of the carbon source gas and the hydrogen gas is in a range from about 3:1, a temperature in the reacting chamber is in a range from about 800° C. to about 1100° C. with a constant temperature period in a range from about 5 minutes to about 30 minutes, and a pressure in the reacting chamber is in a range from about 66.7 Pa to about 10 5 Pa; and
transferring the graphene film from the metal substrate on the insulating substrate.