Nonvolatile semiconductor memory device and method of manufacturing the same

1. A nonvolatile semiconductor memory device comprising a first memory cell string stacked body including a first memory cell string having first memory cell transistors serially connected in a first direction above a semiconductor substrate, and a second memory cell string having second memory cell transistors serially connected in the first direction below a first channel semiconductor film, and one of the first memory cell transistors and one of the second memory cell transistors sharing with a first control gate electrode,

wherein the first control gate electrode is formed so as to cover an upper surface of a first charge storage layer and at least a part of a side surface in a second direction intersecting the first direction via a first insulating film in the one of the first memory cell transistors, and

the first control gate electrode is formed so as to cover only a lower surface of a second charge storage layer via a second insulating film in the one of the second memory cell transistors.

2. The nonvolatile semiconductor memory device according to claim 1 , wherein

the first memory cell string further includes a first select gate transistor arranged at one end of the first memory cell string,

the second memory cell string further includes a second select gate transistor arranged at one end of the second memory cell string, and

the second select gate transistors have an inverted structure of the first select gate transistors relative to a main surface of the semiconductor substrate.

3. The nonvolatile semiconductor memory device according to claim 2 , wherein the first select gate transistors and the second select gate transistors share with the gate electrode.

4. The nonvolatile semiconductor memory device according to claim 2 , wherein insulating films are arranged between gate electrodes of the first select gate transistors and the second select gate transistors.

5. The nonvolatile semiconductor memory device according to claim 3 , further comprising a control circuit connected to the gate electrodes,

wherein the control circuit is configured to adjust a first threshold voltage of the second select gate transistors so as to select either the first select gate transistors or the second select gate transistors.

6. The nonvolatile semiconductor memory device according to claim 5 , wherein

the second select gate transistors include an electrode being identical to the second memory cell transistors, and

the control circuit is configured to control a voltage to be applied to the gate electrodes so as to be accumulated in a second charge storage layer of the second select gate transistors so that the first threshold voltage becomes higher than a second threshold voltage of the first select gate transistors, and so as to be discharged from the second charge storage layer so that the first threshold voltage becomes lower than the second threshold voltage.

7. The nonvolatile semiconductor memory device according to claim 6 , wherein the control circuit is configured to control the first threshold voltage before an access to the one of the first memory cell transistors or the one of the second memory cell transistors, and control the voltage to be applied to the gate electrodes based on relationship of the first threshold voltage and the second threshold voltage and based on an access to the one of the first memory cell transistors or an access to the one of the second memory cell.

8. The nonvolatile semiconductor memory device according to claim 1 , wherein

the semiconductor substrate is configured of a single crystal, and

the first channel semiconductor film is configured of polycrystal.

9. The nonvolatile semiconductor memory device according to claim 1 , further comprising one or more second memory cell string stacked bodies including a third memory cell string having third memory cell transistors serially connected in the first direction above the first channel semiconductor film, and a fourth memory cell string having fourth memory cell transistors serially connected in the first direction below a second channel semiconductor film, and one of the third memory cell transistors and one of the fourth memory cell transistors sharing with a second control gate electrode,

wherein the third memory cell transistors are formed so as to cover an upper surface and at least a part of a side surface in the second direction of a third charge storage layer via a third insulating film, and

the fourth memory cell transistors formed so as to cover only a lower surface of a fourth charge storage layer via a fourth insulating film.

10. The nonvolatile semiconductor memory device according to claim 9 , wherein

the third memory cell string further includes a third select gate transistor arranged at one end of the third memory cell string,

the fourth memory cell string further includes a fourth select gate transistor arranged at one end of the fourth memory cell string, and

the fourth select gate transistors have an inverted structure of the third select gate transistors relative to a main surface of the semiconductor substrate.

11. The nonvolatile semiconductor memory device according to claim 10 , wherein the third select gate transistors and the fourth select gate transistors share with the gate electrode.

12. The nonvolatile semiconductor memory device according to claim 10 , wherein insulating films are arranged between gate electrodes of the third select gate transistors and the fourth select gate transistors.

13. The nonvolatile semiconductor memory device according to claim 9 , wherein

the semiconductor substrate is configured of a single crystal, and

the first channel semiconductor film and the second channel semiconductor film are configured of polycrystal.

14. The nonvolatile semiconductor memory device according to claim 1 , wherein the second memory cell strings are used as a storage memory, and the first memory cell string is used as a cache memory.

15. The nonvolatile semiconductor memory device according to claim 1 , wherein

the first memory cell string is configured to be capable of storing binary data, and

the second memory cell strings is configured to be capable of storing multi-value data of two bits or more.