Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
In a power semiconductor module, a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged successively and fixedly connected with one another. The connection layer has a portion of intermetallic copper-tin phases of at least 90% by weight. For producing such a power semiconductor module the soldering partners and the solder arranged there between are pressed against one another with a predefined pressure and the solder is melted. After termination of a predefined period of time the diffused copper and the tin from the liquid solder form a connection layer comprising intermetallic copper-tin phases, the portion of which is at least 90% by weight of the connection layer created from the solder layer.
1. A power semiconductor module, in which a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged successively and soldered together, wherein:
the copper-containing first soldering partner has a first surface directly abutting against the connection layer;
the copper-containing second soldering partner has a second surface directly abutting against the connection layer; and
the connection layer has a portion of intermetallic copper-tin phases of at least 90% by volume, wherein the connection layer comprises a tin-containing solder disposed between the copper-containing first and second soldering partners, the tin-containing solder including copper from the copper-containing first and second soldering partners.
2. The power semiconductor module according to claim 1 , wherein the first surface and/or the second surface have a surface roughness R z of less than or equal to 10 μm.
3. The power semiconductor module according to claim 1 , wherein the first surface and/or the second surface have a surface roughness R z of less than 4 μm.
4. The power semiconductor module according to claim 1 , wherein the first surface and/or the second surface have a surface roughness Rz from 4 μm to 6 μm.
5. The power semiconductor module according to claim 1 , wherein the first surface and/or the second surface have a surface roughness Rz from 6 μm to 8 μm.
6. The power semiconductor module according to claim 1 , wherein the first surface and/or the second surface have a surface roughness Rz from 8 μm to 10 μm.
7. The power semiconductor module according to claim 1 , wherein the connection layer comprises at least one of the intermetallic copper-tin phases Cu 6 Sn 5 , Cu 3 Sn, Cu 10 Sn 3 , Cu 41 Sn 11 .
8. The power semiconductor module according to claim 1 , wherein the connection layer only comprises the intermetallic copper-tin phases Cu 6 Sn 5 and Cu 3 Sn.
9. The power semiconductor module according to claim 1 , wherein the connection layer only comprises the intermetallic copper-tin phase Cu 3 Sn.
10. The power semiconductor module according to claim 1 , wherein at least 90% by volume of the connection layer has a melting point of at least 415° C.
11. The power semiconductor module according to claim 1 , wherein at least 90% by volume of the connection layer has a melting point of at least 676° C.
12. The power semiconductor module according to claim 1 , wherein the connection layer comprises a tin-based solder with a portion of 3.5% by weight of silver (Ag).
13. The power semiconductor module according to claim 8 , wherein the connection layer comprises a tin-based solder with a portion of 0.1% by weight to 6% by weight of silver (Ag).
14. The power semiconductor module according to claim 1 , wherein the connection layer comprises a tin-based solder, which is alloyed with one of the substances silver (Ag), copper (Cu), nickel (Ni), indium (In), bismuth (Bi), zinc (Zn), antimony (Sb), germanium (Ge) or lead (Pb).
15. The power semiconductor module according to claim 10 , wherein the connection layer comprises a tin-based solder, which is alloyed with at least two of the substances silver (Ag), copper (Cu), nickel (Ni), indium (In), bismuth (Bi), zinc (Zn), antimony (Sb), germanium (Ge) or lead (Pb).
16. The power semiconductor module according to claim 1 , wherein
the copper-containing first soldering partner and/or the copper-containing second soldering partner comprises a copper portion of at least 70% by weight or is completely composed of copper.
17. The power semiconductor module according to claim 1 , wherein
the copper-containing first soldering partner and/or the copper-containing second soldering partner is embodied as a metallization of a semiconductor chip, as a copper disk, as a copper ribbon, as a contact wire, as a coating of a contact wire, as a clip, as a coating of a clip, as a circuit carrier for a semiconductor chip or as a coating for a circuit carrier of a semiconductor chip, or as a base plate or a coating for a base plate.
18. The power semiconductor module according to claim 1 , wherein the copper-containing first soldering partner is embodied as base plate or as coating of a base plate of the power semiconductor module, and wherein the copper-containing second soldering partner is a substrate or a coating of a substrate.
19. The power semiconductor module according to claim 1 , wherein
the copper-containing first soldering partner and/or the copper-containing second soldering partner are substantially made of metal and has a thickness from 1 μm to 5 μm.
20. The power semiconductor module accordingly to claim 1 , wherein a diffusion layer, a buffer layer, and semiconductor body are arranged successively on the copper-containing first soldering partner.