Semiconductor device with dual work function gate stacks and method for fabricating the same
A method for fabricating a semiconductor device includes forming a gate dielectric layer over a substrate; forming a metal containing layer, containing an effective work function adjust species, over the gate dielectric layer; forming an anti-reaction layer over the metal containing layer; increasing an amount of the effective work function adjust species contained in the metal containing layer; and forming, on the substrate, a gate stack by etching the anti-reaction layer, the metal containing layer, and the gate dielectric layer.
1. A semiconductor device comprising:
a substrate comprising a first region and a second region;
a first gate stack formed over the first region, the first gate stack comprising:
a first metal containing gate electrode containing a first effective work function adjust species;
an anti-reaction layer formed over the first metal containing gate electrode; and
a metal containing layer formed over the anti-reaction layer; and
a second gate stack formed over the second region, the second gate stack comprising:
a second metal containing gate electrode containing a second effective work function adjust species
wherein the anti-reaction layer is formed between the first metal containing gate electrode and the metal containing layer,
wherein the anti-reaction layer comprises polysilicon.
2. The semiconductor device of claim 1 , wherein the metal containing layer comprising a same material as a material of the second metal containing gate electrode.
3. The semiconductor device of claim 1 , wherein the first effective work function adjust species comprises nitrogen.
4. The semiconductor device of claim 1 , wherein the second effective work function adjust species comprises titanium.
5. The semiconductor device of claim 1 , wherein the first metal containing gate electrode comprises titanium nitride (TiN) including nitrogen at a higher ratio than a chemical stoichiometric ratio of titanium to nitrogen.
6. The semiconductor device of claim 1 , wherein the second metal containing gate electrode comprises titanium nitride (TiN) including titanium at a higher ratio than a chemical stoichiometric ratio of titanium to nitrogen.
7. The semiconductor device of claim 1 , wherein the first gate stack comprises a gate stack of a P-channel transistor.
8. The semiconductor device of claim 1 , wherein the second gate stack comprises a gate stack of an N-channel transistor.
9. The semiconductor device of claim 1 , wherein the first gate stack further comprises a first interface layer and a first high-k material formed under the first metal containing gate electrode, and
the second gate stack further comprises a second interface layer and a second high-k material formed under the second metal containing gate electrode.