Electronic circuit apparatus
For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.
1. An electronic circuit apparatus in which a shunt resistor, including a resistance element between electrodes, is surface-mounted to a substrate and in which electric current flowing from a current-generating-side pattern into a current-receiving-side pattern is detected by the shunt resistor that is arranged on a path of the electric current, wherein
at least one of the electrodes of the shunt resistor is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted, and
the surface-mounting pattern is connected to the current-generating-side pattern or the current-receiving-side pattern via a connection member which creates a space between the connection member itself and the substrate.
2. The electronic circuit apparatus of claim 1 , wherein
the connection member is a bus bar made of a conductor having high thermal conductivity.
3. The electronic circuit apparatus of claim 2 , wherein
at a point where the electrode of the shunt resistor is connected to the surface-mounting pattern, the surface-mounting pattern has a width set to be equal to the length of the electrode of the shunt resistor.
4. The electronic circuit apparatus of claim 3 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving side pattern and having a predetermined height, and
a connector connecting the legs together.
5. The electronic circuit apparatus of claim 4 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
6. The electronic circuit apparatus of claim 3 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
7. The electronic circuit apparatus of claim 2 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.
8. The electronic circuit apparatus of claim 7 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
9. The electronic circuit apparatus of claim 2 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
10. The electronic circuit apparatus of claim 1 , wherein
at a point where the electrode of the shunt resistor is connected to the surface-mounting pattern, the surface-mounting pattern has a width set to be equal to the length of the electrode of the shunt resistor.
11. The electronic circuit apparatus of claim 10 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.
12. The electronic circuit apparatus of claim 11 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
13. The electronic circuit apparatus of claim 10 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
14. The electronic circuit apparatus of claim 1 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.
15. The electronic circuit apparatus of claim 14 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.
16. The electronic circuit apparatus of claim 1 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members respectively.