Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device

1. A heat dissipation adhesive film comprising:

a heat dissipation adhesive layer, the heat dissipation adhesive layer being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer to bond the protective layer to the heat dissipation metal layer, wherein:

an adhesive strength between the heat dissipation adhesive layer and the protective layer is about 3 kgf/25 mm 2 or greater,

an adhesive strength between the heat dissipation adhesive layer and the heat dissipation metal layer is about 3 kgf/25 mm 2 or greater, and

the heat dissipation adhesive layer is prepared from a composition that includes:

about 5 wt % to about 35 wt % of a polymer resin,

about 1 wt % to about 35 wt % of an epoxy resin, and

about 20 wt % to about 85 wt % of thermally conductive particles, based on a total weight of the composition.

2. The heat dissipation adhesive film as claimed in claim 1 , wherein the thermally conductive particles include at least one selected from the group of alumina, aluminum nitride, aluminum oxide, boron nitride, aluminum hydroxide, magnesium hydroxide, calcium carbide, magnesium carbide, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, titanium dioxide, and iron oxide particles.

3. The heat dissipation adhesive film as claimed in claim 1 , wherein the heat dissipation adhesive layer further includes a base film.

4. The heat dissipation adhesive film as claimed in claim 1 , wherein the thermally conductive particles are present in an amount of about 30 wt % to about 80 wt %, based on the total weight of the composition.

5. The heat dissipation adhesive film as claimed in claim 1 , wherein the heat dissipation adhesive film has a thermal conductivity of 1 W/mK or greater.

6. The heat dissipation adhesive film as claimed in claim 1 , wherein the polymer resin includes an epoxy group containing acrylic polymer resin.

7. The heat dissipation adhesive film as claimed in claim 1 , wherein the thermally conductive particles include aluminum nitride or boron nitride.

8. A semiconductor device, comprising:

a semiconductor element;

a protective layer encasing the semiconductor element therein;

a heat dissipation adhesive layer on the protective layer; and

a heat dissipation metal layer on the heat dissipation adhesive layer,

wherein:

an adhesive strength between the heat dissipation adhesive layer and the protective layer is about 3 kgf/25 mm 2 or greater, and

an adhesive strength between the heat dissipation adhesive layer and the heat dissipation metal layer is about 3 kgf/25 mm 2 or greater, and

the heat dissipation adhesive layer is prepared from a composition that includes:

about 5 wt % to about 35 wt % of a polymer resin,

about 1 wt % to about 35 wt % of an epoxy resin, and

about 20 wt % to about 85 wt % of thermally conductive particles, based on a total weight of the composition.

9. The semiconductor device as claimed in claim 8 , wherein:

the semiconductor element includes an exposed surface that is not encased by the protective layer, and

the heat dissipation adhesive layer contacts both the exposed surface and the protective layer.

10. The semiconductor device as claimed in claim 9 , wherein the adhesive strength between the heat dissipation adhesive layer and the semiconductor element is about 3 kgf/25 mm 2 or greater.

11. The semiconductor device as claimed in claim 8 , wherein the heat dissipation adhesive layer has a thermal conductivity of about 1 W/mK or greater.

12. The semiconductor device as claimed in claim 8 , wherein the polymer resin includes an epoxy group containing acrylic polymer resin.

13. The semiconductor device as claimed in claim 8 , wherein the thermally conductive particles include aluminum nitride or boron nitride.

14. A method of fabricating a semiconductor device, the method comprising:

forming a protective layer encasing a semiconductor element therein,

forming a heat dissipation adhesive layer and a heat dissipation metal layer on the protective layer, the heat dissipation adhesive layer having a thermal conductivity of about 1 W/mK or greater,

wherein forming the heat dissipation adhesive layer includes applying a composition, the composition including:

about 5 wt % to about 35 wt % of a polymer resin,

about 1 wt % to about 35 wt % of an epoxy resin, and

about 20 wt % to about 85 wt % of thermally conductive particles, based on a total weight of the composition.

15. The method as claimed in claim 14 , wherein:

an adhesive strength between the heat dissipation adhesive layer and the protective layer is about 3 kgf/25 mm 2 or greater, and

an adhesive strength between the heat dissipation adhesive layer and the heat dissipation metal layer is about 3 kgf/25 mm 2 or greater.

16. The method as claimed in claim 14 , wherein, in forming of the protective layer, the semiconductor element includes an exposed surface that is not encased by the protective layer, and the heat dissipation adhesive layer contacts both the exposed surface and the protective layer.

17. The method as claimed in claim 16 , wherein an adhesive strength between the heat dissipation adhesive layer and the semiconductor element is about 3 kgf/25 mm 2 or greater.

18. The method as claimed in claim 14 , wherein the forming the heat dissipation adhesive layer and the heat dissipation metal layer includes forming together a heat dissipation adhesive film on the protective layer, the heat dissipation adhesive film including a heat dissipation metal layer and a heat dissipation adhesive layer having a thermal conductivity of 1 W/mK or more.

19. The method as claimed in claim 14 , wherein the polymer resin includes an epoxy group containing acrylic polymer resin.

20. The method as claimed in claim 14 , wherein the thermally conductive particles include aluminum nitride or boron nitride.