Electronic device antenna structures with ferrite layers
Electronic devices may be provided that have antenna traces. The antenna traces may be configured to form an inductive loop that serves as a near field communications antenna. A layer of ferrite may be provided to reduce interference between the antenna and internal device components. The layer of ferrite and the antenna traces may be deposited on a common substrate such as a layer of polymer or a dielectric electronic device housing. A protective layer of polymer may be used to form a coating on the layer of ferrite. Ferrite may be formed on the same side of a substrate as the antenna traces or may be formed on an opposing side of the substrate.
1. An electronic device, comprising:
a housing;
antenna structures mounted in the housing, wherein the antenna structures include:
a layer of polymer having first and second opposing sides and conductive vias extending from the first side to the second side,
metal antenna traces formed on the first side of the layer of polymer,
a ferrite layer formed on the first side of the layer of polymer that directly covers the antenna traces, and
a layer of adhesive located between the layer of polymer and the housing so that the layer of adhesive mounts the layer of polymer directly to the housing;
a set of electrical contacts at the second side of the layer of polymer that are electrically connected to the conductive vias; and
an integrated circuit at the second side of the layer of polymer that is electrically connected to the metal antenna traces through the set of electrical contacts and the conductive vias.
2. The electronic device defined in claim 1 wherein the ferrite layer comprises a polymer ferrite layer.
3. The electronic device defined in claim 1 wherein the metal antenna traces are configured to form an inductive loop for a near field communications antenna.
4. The electronic device defined in claim 1 further comprising an additional polymer layer, wherein the additional polymer layer is formed directly over the ferrite layer.
5. The electronic device defined in claim 1 wherein the ferrite layer comprises a ceramic ferrite, wherein the electronic device further comprises an additional polymer layer, and wherein the additional polymer layer is formed on the ceramic ferrite layer.
6. An electronic device having a length, a width, and a height, wherein the length is greater than the width and the width is greater than the height, comprising:
a housing for the electronic device;
a display module formed within the housing;
a display cover layer formed over the display module, wherein the display cover layer extends across the length and the width of the electronic device and the housing comprises a rear housing portion that opposes the display cover layer; and
antenna structures mounted in the housing, wherein the antenna structures include:
a layer of polymer,
a ferrite layer formed on the layer of polymer, wherein a first side of the ferrite layer is in direct contact with the polymer, and
metal antenna traces formed on and in direct contact with a second side of the layer of ferrite that opposes the first side, wherein the ferrite layer is interposed between the metal antenna traces and the layer of polymer; and
a layer of adhesive interposed between the ferrite layer and the housing, wherein the metal antenna traces are interposed between the ferrite layer and the layer of adhesive, and wherein the layer of adhesive is configured to mount the antenna structures directly to the rear housing portion such that the adhesive is in direct contact with the rear housing portion; and
at least one integrated circuit that is directly connected to the antenna traces using solder, wherein the antenna traces are interposed directly between the solder and the ferrite layer.
7. The electronic device defined in claim 6 wherein the ferrite layer comprises a polymer ferrite layer.
8. The electronic device defined in claim 6 wherein the metal antenna traces are configured to form an inductive loop for a near field communications antenna.
9. The electronic device defined in claim 6 , wherein the at least one integrated circuit comprises transceiver circuitry, wherein the at least one integrated circuit is directly connected to the antenna traces at a first location on the antenna traces and at a second location on the antenna traces that is different from the first location using the solder.
10. The electronic device defined in claim 9 , wherein the solder is interposed directly between the antenna traces and the at least one integrated circuit.