Electronic component built-in substrate and method of manufacturing the same
An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively.
1. An electronic component built-in substrate comprising:
an electronic component having a connection terminal;
a substrate having a core member with an opening in which the electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; and a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole that reaches the connection terminal of the electronic component;
a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member; and
a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole,
wherein
the whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively,
the first auxiliary insulating layer and the filling resin portion are integrally formed of a same resin,
the first auxiliary insulating layer includes a plurality of resin layers, and
the first auxiliary insulating layer includes the filling resin portion as part of one of the plurality of resin layers of the first auxiliary insulating layer that is in contact with the core member.
2. The electronic component built-in substrate according to claim 1 , wherein the first auxiliary insulating layer and the filing resin portion are integrally formed to be continuous with one another.
3. The electronic component built-in substrate according to claim 1 , wherein a thickness of the core member is approximately equal to that of the electronic component.
4. The electronic component built-in substrate according to claim 1 , wherein a thickness of the first wiring layer is greater than that of the connection terminal of the electronic component.
5. The electronic component built-in substrate according to claim 1 , wherein the electronic component is a chip capacitor.
6. The electronic component built-in substrate according to claim 1 , further comprising:
an insulating layer formed on the second auxiliary insulating layer and having a second via hole that reaches the first wiring layer; and
a second wiring layer formed on the insulating layer and connected to the first wiring layer through the second via hole.
7. The electronic component built-in substrate according to claim 6 , wherein:
the insulating layer is made of a resin containing a fiber reinforcement member, and
the second wiring layer includes a metal foil.