Multi-solder techniques and configurations for integrated circuit package assembly
Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.
1. A solder ball for fabrication of an integrated circuit package assembly, the solder ball comprising:
a first solder material, wherein the first solder material is an inner material of the solder ball, is an off-eutectic alloy, and has a liquidus temperature that is greater than a peak temperature of a first solder reflow process and a peak temperature of a second solder reflow process and has a solidus temperature that is less than the peak temperatures of the first and second reflow processes; and
a second solder material, wherein the second solder material is an outer material of the solder ball and has a liquidus temperature that is less than the peak temperature of the first and second solder reflow processes.
2. The solder ball of claim 1 , wherein the peak temperatures of the first solder reflow process and the second solder reflow process are temperatures from 230° C. to 250° C.
3. The solder ball of claim 1 , further comprising:
a core composed of a polymer or metal, wherein the first solder material is disposed to surround the core and the second solder material is disposed to surround the first solder material.
4. The solder ball of claim 1 , wherein:
the first solder material includes an off-eutectic alloy of tin (Sn) and copper (Cu) having a liquidus temperature greater than 260° C.; and
the second solder material includes an alloy of tin (Sn), silver (Ag), and copper (Cu).
5. The solder ball of claim 1 , wherein:
the first solder material includes an alloy of bismuth (Bi) and silver (Ag), an alloy of cadmium (Cd) and Zinc (Zn), or an alloy of tin (Sn), silver (Ag) and antimony (Sb); and
the second solder material includes an alloy of tin (Sn), silver (Ag), and copper (Cu).
6. An integrated circuit package assembly, the assembly comprising:
a package substrate having a plurality of pads; and
a plurality of solder balls coupled with the plurality of pads, wherein individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of a first solder reflow process that is used to form solder joints between the plurality of solder balls and the plurality of pads, and the second solder material having a liquidus temperature that is less than the peak temperature of the first solder reflow process, wherein the first solder material is an inner material of the solder ball and the second solder material is an outer material of the solder ball; and
a circuit board coupled with the package substrate by the plurality of solder balls, the circuit board having a plurality of pads corresponding with the plurality of solder balls, wherein the first solder material is an off-eutectic alloy having a liquidus temperature that is greater than a peak temperature of a second solder reflow process that is used to form solder joints between the first solder material and the second solder material of the individual solder balls and corresponding pads of the plurality of pads of the circuit board and a solidus temperature that is less than the peak temperatures of the first solder reflow process and the second solder reflow process, and the second solder material has a liquidus temperature that is less than the peak temperature of the second solder reflow process.
7. The assembly of claim 6 , wherein the peak temperatures of the first solder reflow process and the second solder reflow process are temperatures from 230° C. to 250° C.
8. The assembly of claim 6 , wherein one or more of the individual solder balls include a core composed of a polymer or metal that is to provide a structural barrier that defines a collapse distance between the package substrate and the circuit board, wherein the first solder material is disposed to surround the core and the second solder material is disposed to surround the first solder material.
9. The assembly of claim 6 , wherein the plurality of solder balls comprises:
one or more solder balls composed of a single, contiguous alloy material disposed on corresponding one or more pads of the plurality of pads that are disposed in a central region of the package substrate, wherein the individual solder balls are disposed on corresponding one or more pads of the plurality of pads that are disposed in a peripheral region of the package substrate.
10. The assembly of claim 6 , wherein:
the first solder material includes an off-eutectic alloy of tin (Sn) and copper (Cu) having a liquidus temperature greater than 260° C.; and
the second solder material includes an alloy of tin (Sn), silver (Ag), and copper (Cu).
11. The assembly of claim 6 , wherein:
the first solder material includes an alloy of bismuth (Bi) and silver (Ag), an alloy of cadmium (Cd) and Zinc (Zn), or an alloy of tin (Sn), silver (Ag) and antimony (Sb); and
the second solder material includes an alloy of tin (Sn), silver (Ag), and copper (Cu).
12. The assembly of claim 6 , wherein:
the first solder material has a non-uniform microstructure; and
the second solder material has a uniform microstructure.