Substrate structure having component-disposing area and manufacturing process thereof
A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.
1. A substrate structure having a component-disposing area, comprising:
a core layer, comprising a first surface, a patterned metallic layer and a component-disposing area, wherein the patterned metallic layer is disposed on the first surface and comprises a plurality of pads and the pads are located within the component-disposing area;
a first dielectric-layer, disposed on the core layer and comprising a plurality of openings respectively exposing the pads;
a laser-resistant metallic pattern, disposed on and directly contacting the first dielectric layer and surrounding a projection area of the first dielectric-layer which the component-disposing area orthogonally projected on; and
a second dielectric layer, disposed on the first dielectric layer and covering the laser-resistant metallic pattern, wherein the second dielectric layer comprises a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric layer and communicated with the openings to expose the pads, and the component-disposing cavity exposing a part of the laser-resistant metallic pattern surrounding the projection area.
2. The substrate structure having the component-disposing area as claimed in claim 1 , further comprising:
an electronic component, disposed in the component-disposing cavity and electrically connected to the pads.
3. The substrate structure having the component-disposing area as claimed in claim 2 , further comprising:
a plurality of bonding wires, electrically connected to the pads and the electronic component respectively.
4. The substrate structure having the component-disposing area as claimed in claim 2 , further comprising:
a plurality of solder balls, electrically connected to the pads and the electronic component respectively.
5. The substrate structure having the component-disposing area as claimed in claim 1 , wherein material of the laser-resistant metallic pattern comprises copper, palladium, nickel and silver.