IP Library › Granted Patent US 9,259,754
Granted Patent B2
US 9,259,754 · App. 14/310,986 · Granted Feb 16, 2016

Microfluidic delivery member with filter and method of forming same

Inventors: Simon Dodd (West Linn, OR); Joe Scheffelin (Poway, CA); Dana Gruenbacher (Fairfield, OH); Teck Khim Neo (Singapore, SG); Dave Hunt (San Diego, CA); Faiz Sherman (Mason, OH)
Assignees: STMICROELECTRONICS ASIA PACIFIC PTE LTD; STMICROELECTRONICS, INC.
B05B15/008B05B1/14B05B9/01H01L24/33H01L24/49H01L24/73H01L24/83H01L24/85H01L24/91H01L24/97H05K3/305H01L2224/32245H01L2224/48106H01L2224/48227H01L2224/73265H01L2224/8385H01L2224/8389H01L2224/83192Y10T156/1089
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,259,754
App. No.
14/310,986
Granted
Feb 16, 2016
Kind
B2
Abstract

Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Claims (33)

1. A microfluidic delivery member comprising:

a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface;

a filter secured to the second surface of the printed circuit board over the through hole; and

a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluid communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path.

2. The microfluidic delivery member of claim 1 wherein the filter includes at least one of a stainless steel mesh, randomly weaved mesh, polypropylene or a substrate material with a plurality of holes.

3. The microfluidic delivery member of claim 1 wherein the plurality of nozzles have a diameter between 15 and 30 microns.

4. The microfluidic delivery member of claim 3 , wherein the filter is configured to filter particles greater than one third of the diameter of the nozzles.

5. The microfluidic delivery member of claim 1 , further comprising a mechanical spacer located between the filter and the second surface of the printed circuit board, to space the filter from the second surface of the printed circuit board by a first distance.

6. The microfluidic delivery member of claim 5 , wherein the first distance is between 100 and 700 microns from the second surface of the printed circuit board.

7. The microfluidic delivery member of claim 5 , further comprising a liner on sidewalls of the through hole, the liner being integral with the mechanical spacer.

8. The microfluidic delivery member of claim 5 , wherein the mechanical spacer is one of a raised portion of solder mask formed on the printed circuit board and adhesive material.

9. The microfluidic delivery member of claim 5 , further comprising a liner on sidewalls of the through hole, the liner being spaced apart from the mechanical spacer.

10. The microfluidic delivery member of claim 9 , wherein the liner includes ends that extend on the first and second surfaces of the printed circuit board at the through hole.

11. A microfluidic delivery member comprising:

a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface;

a filter secured to the printed circuit board and facing the through hole; and

a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the filter with the inlet path in fluid communication with the through hole of the printed circuit board through the filter, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path.

12. The microfluidic delivery member of claim 11 further comprising first and second mechanical spacers, the first mechanical spacer being located between the printed circuit board and the filter and the second mechanical spacer being located between the filter and the die.

13. The microfluidic delivery member of claim 12 wherein the first mechanical spacer is a raised portion of solder mask formed on the printed circuit board.

14. The microfluidic delivery member of claim 12 wherein the first and second mechanical spacers are between 100 and 700 microns thick.

15. The microfluidic delivery member of claim 11 further comprising an adhesive material that secures the filter to the printed circuit board.

16. The microfluidic delivery member of claim 11 , wherein the filter is located between the printed circuit board and the semiconductor die.

17. The microfluidic delivery member of claim 16 , wherein the filter has a first surface that includes a recess, the recess facing the inlet path of the semiconductor die.

18. The microfluidic delivery member of claim 16 , further comprising first and second mechanical spacers, the first mechanical spacer being located between the semiconductor die and the filter and the second mechanical spacer being located between the filter and the printed circuit board.

19. A microfluidic delivery member comprising:

a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface; and

a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluid communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path, the plurality of nozzles being configured to expel a fluid received through the through hole of the printed circuit board.

20. The microfluidic delivery member of claim 19 , further comprising a filter secured to the second surface of the printed circuit board.

21. The microfluidic delivery member of claim 20 wherein the filter includes at least one of a stainless steel mesh, randomly weaved mesh, polypropylene or a substrate material with a plurality of holes.

22. The microfluidic delivery member of claim 20 wherein the plurality of nozzles have a diameter between 15 and 30 microns.

23. The microfluidic delivery member of claim 22 , wherein the filter is configured to filter particles greater than one third of the diameter of the nozzles.

24. The microfluidic delivery member of claim 20 , further comprising a liner on sidewalls of the through hole, a first portion of the liner being located on the second surface of the printed circuit board and securing the filter to printed circuit board.

25. The microfluidic delivery member of claim 24 , wherein the liner includes a second portion located on the first surface of the printed circuit board, the second portion being shorter than the first portion.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 059246/0754 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2022
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 058835/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 058835/0877 →
QUITCLAIM ASSIGNMENT Recorded Feb 25, 2021
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS, INC.; STMICROELECTRONICS S.R.L.; STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 055421/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: THE PROCTER & GAMBLE COMPANY
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 055414/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: SCHEFFELIN, JOE; HUNT, DAVE
To: STMICROELECTRONICS S.R.L.
Reel/Frame 055396/0118 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: GRUENBACHER, DANA; SHERMAN, FAIZ
To: THE PROCTER & GAMBLE COMPANY
Reel/Frame 055396/0128 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2014
From: BRIOSCHI, ROBERTO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 033261/0813 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2014
From: DODD, SIMON; SCHEFFELIN, JOE; GRUENBACHER, DANA; HUNT, DAVE; SHERMAN, FAIZ
To: STMICROELECTRONICS, INC.
Reel/Frame 033261/0774 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2014
From: NEO, TECK KHIM
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD
Reel/Frame 033261/0824 →
Continuity (1)
Related Publication 20150367370A1 · Dec 24, 2015