Apparatus and method for treating substrate

1. An apparatus for treating a substrate, the apparatus comprising:

a load port on which a container for receiving the substrate is placed;

a treatment module for treating the substrate; and

a transfer module comprising a robot for transferring the substrate between the container and the treatment module;

wherein the treatment module comprises:

a transfer chamber comprising a robot for transferring the substrate,

a load lock chamber disposed between the transfer chamber and the transfer module,

a first treatment chamber spaced apart from the transfer module about a perimeter of the transfer chamber to perform a first treatment process, and

a second treatment chamber disposed around the transfer chamber to perform a second treatment process, wherein the second treatment chamber comprises a housing disposed under the load lock chamber, a plasma source disposed above the load lock chamber to generate plasma, and a supply tube disposed on an outer wall of the load lock chamber to supply the generated plasma into the housing; and

wherein the second treatment chamber is disposed between the transfer chamber and the transfer module and is configured to transfer the substrate between the transfer module and the treatment module.

2. The apparatus of claim 1 , wherein the housing of the second treatment chamber has

a first opening in a side surface thereof facing the transfer chamber and a second opening in a side surface thereof facing the transfer module;

and the second treatment chamber further comprises:

a first door for opening or closing the first opening;

a second door for opening or closing the second opening;

a decompression member for decompressing the inside of the housing;

a support member disposed within the housing to support the substrate; and

a heating member for heating the substrate placed on the support member.

3. The apparatus of claim 1 , wherein the housing of the second treatment chamber has

a first side surface, in which a first opening is defined, facing the transfer chamber and a second side, which is blocked;

a first door for opening or closing the first opening; and

a support member disposed within the housing to support the substrate; and

a heating member for heating the substrate placed on the support member.

4. The apparatus of claim 1 , wherein the load lock chamber comprises:

a housing providing a buffer space, the housing having a first opening in a side surface thereof facing the transfer chamber and a second opening in a side surface thereof facing the transfer module;

a first door for opening or closing the first opening;

a second door for opening or closing the second opening; and

at least one slot supporting the substrate so that the substrate is disposed in the buffer space.

5. The apparatus of claim 1 , wherein the load lock chamber and the second treatment chamber are stacked on each other.

6. The apparatus of claim 5 , wherein the second treatment chamber is disposed under the load lock chamber.

7. The apparatus of claim 1 , wherein the treatment module comprises a plurality of second treatment chambers.

8. The apparatus of claim 7 , wherein the treatment module comprises:

a plasma source generating plasma; and

a supply tube supplying the generated plasma into a housing of each of plurality of second treatment chambers,

wherein the supply tube is connected to the plasma source and branched into the plurality of second treatment chambers, and a valve is disposed in each of the branched supply tubes.

9. The apparatus of claim 7 , wherein the plurality of second treatment chambers are stacked on each other.

10. The apparatus of claim 7 , wherein the plurality of second treatment chambers are disposed in parallel in a lateral direction.

11. The apparatus of claim 1 , wherein the second treatment chamber is stacked with the first treatment chamber.

12. An apparatus for treating a substrate, the apparatus comprising:

a load port on which a container for receiving the substrate is placed;

a treatment module for treating the substrate; and

a transfer module comprising a robot for transferring the substrate between the container and the treatment module;

wherein the treatment module comprises:

a transfer chamber comprising a robot for transferring the substrate,

a first treatment chamber spaced apart from the transfer module about a perimeter of the transfer chamber to perform a first treatment process,

a load lock chamber disposed between the transfer chamber and the transfer module, wherein the load lock chamber comprises a first housing providing a buffer space, and at least one slot to support the substrate so that the substrate is disposed in the buffer space, and

a second treatment chamber disposed between the transfer chamber and the transfer module and configured to transfer the substrate between the transfer module and the treatment module, wherein the second treatment chamber comprises a second housing disposed under the first housing, a support member disposed within the second housing to support the substrate, a plasma source disposed above the first housing to generate plasma, and a supply tube supplying the generated plasma into the second housing; and

wherein the load lock chamber and the second treatment chamber have interior chambers different from each other,

wherein the load lock chamber and the second treatment chamber are stacked on each other and the second treatment chamber is disposed under the load lock chamber.