Techniques and system for managing platform temperature

1. An apparatus, comprising:

a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform; and

a controller comprising logic at least a portion of which is in hardware, the logic to:

receive from the temperature sensor the multiplicity of junction temperature measurements;

determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;

determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and

instruct the component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or

instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based the multiplicity of junction temperature measurements exceeds the second threshold.

2. The apparatus of claim 1 , the first threshold comprising a maximum junction temperature T J — MAX for the component, the logic to perform a rapid throttling of the component when the first threshold is exceeded, the rapid throttling comprising reducing micro-operations input rate and/or operating frequency for the component.

3. The apparatus of claim 1 , the second threshold comprising a maximum steady state junction temperature T J — STEADY STATE , the logic to perform a controlled power down of the component when the second threshold is exceeded, wherein skin temperature of the platform does not exceed about 40° C.

4. The apparatus of claim 1 the logic to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

5. The apparatus of claim 1 , comprising:

a second temperature sensor to perform a multiplicity of second junction temperature measurements for a second component of the platform; and

the logic to receive from the second temperature sensor the multiplicity of second junction temperature measurements and to instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold and to instruct the second component to perform a fourth power down action when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

6. The apparatus of claim 1 , the component comprising a general purpose processor (CPU), a graphics processor unit (GPU), a memory device, and/or a chipset.

7. At least one non-transitory computer-readable storage medium comprising instructions that, when executed, cause a controller to:

receive from a temperature sensor a multiplicity of junction temperature measurements;

determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;

determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and

instruct a component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or

instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based on the multiplicity of junction temperature measurements exceeds the second threshold.

8. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to perform a rapid throttling of the component when a maximum junction temperature T J — MAX is exceeded, the rapid throttling action comprising reducing micro-operations input rate and/or operating frequency for the component.

9. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to perform a controlled power down of the component when a maximum steady state junction temperature T J — STEADY STATE is exceeded.

10. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

11. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to:

receive from a second temperature sensor a multiplicity of second junction temperature measurements for a second component;

instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold; and

instruct the second component to perform a fourth power down when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

12. An apparatus, comprising:

a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform; and

a processor comprising logic at least a portion of which is in hardware, the logic to:

receive from the temperature sensor the multiplicity of junction temperature measurements;

determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;

determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and

instruct the component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or

instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based the multiplicity of junction temperature measurements exceeds the second threshold.

13. The apparatus of claim 12 , the first threshold comprising a maximum junction temperature T J — MAX for the component, the logic to perform a rapid throttling of the component when the first threshold is exceeded, the rapid throttling comprising reducing micro-operations input rate and/or operating frequency for the component.

14. The apparatus of claim 12 , the second threshold comprising a maximum steady state junction temperature T J — STEADY STATE , the logic to perform a controlled power down of the component when the second threshold is exceeded, wherein skin temperature of the platform does not exceed about 40° C.

15. The apparatus of claim 12 the logic to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

16. The apparatus of claim 12 , comprising:

a second temperature sensor to perform a multiplicity of second junction temperature measurements for a second component of the platform; and

the logic to receive from the second temperature sensor the multiplicity of second junction temperature measurements and to instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold and to instruct the second component to perform a fourth power down when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

17. At least one non-transitory computer-readable storage medium comprising instructions that, when executed, cause a processor to:

receive from a temperature sensor a multiplicity of junction temperature measurements;

determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;

determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and

instruct a component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurement exceeds the first threshold; or

instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based on the multiplicity of junction temperature measurements exceeds the second threshold.

18. The at least one computer-readable storage medium of claim 17 comprising instructions that, when executed, cause a controller to perform a rapid throttling of the component when a maximum junction temperature T J — MAX is exceeded, the rapid throttling action comprising reducing micro-operations input rate and/or operating frequency for the component.

19. The at least one computer-readable storage medium of claim 17 comprising instructions that, when executed, cause a controller to perform a controlled power down of the component when a maximum steady state junction temperature T J — STEADY STATE is exceeded.

20. The at least one computer-readable storage medium of claim 17 comprising instructions that, when executed, cause a controller to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

21. The at least one computer-readable storage medium of claim 17 comprising instructions that, when executed, cause a controller to:

receive from a second temperature sensor a multiplicity of second junction temperature measurements for a second component;

instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurement exceeds a third threshold; and

instruct the second component to perform a fourth power down when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

22. A system, comprising:

a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform; and

control logic to:

receive from the temperature sensor the multiplicity of junction temperature measurements;

determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;

determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and

instruct the component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or

instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based the multiplicity of junction temperature measurements exceeds the second threshold.

23. The system of claim 22 , the first threshold comprising a maximum junction temperature T J — MAX for the component, the logic to perform a rapid throttling of the component when the first threshold is exceeded, the rapid throttling comprising reducing micro-operations input rate and/or operating frequency for the component.

24. The system of claim 22 , the second threshold comprising a maximum steady state junction temperature T J — STEADY STATE , the logic to perform a controlled power down of the component when the second threshold is exceeded.

25. The system of claim 22 , the control logic to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

26. The system of claim 22 , comprising a processor that includes the control logic.

27. The system of claim 22 , comprising a platform temperature control unit that includes the control logic.