Semiconductor device and method of fabricating same
A lateral drain metal oxide semiconductor (LDMOS) device includes a well region having a second conductive type in a substrate, a body region having a first conductive type in the well region, a drift region having the second conductive type in the well region and spaced apart from the body region, a source region having the second conductive type in the body region, a drain region having the second conductive type in the drift region, a gate structure on the well region between the source region and the drain region, a shallow trench isolation (STI) structure in the drift region between the drain region and the source region, and a buried layer having the first conductive type in the well region under the drift region, a center of the buried layer being aligned with a center of the STI structure.
1. A lateral drain metal oxide semiconductor (LDMOS) device, comprising:
a well region having a second conductive type in a substrate;
a body region having a first conductive type in the well region;
a drift region having the second conductive type in the well region and spaced apart from the body region;
a source region having the second conductive type in the body region;
a drain region having the second conductive type in the drift region;
a gate structure on the well region between the source region and the drain region;
a shallow trench isolation (STI) structure in the drift region between the drain region and the source region; and
a buried layer having the first conductive type in the well region under the drift region, a center of the buried layer being aligned with a center of the STI structure,
wherein the STI structure includes an uppermost surface, an opposing lowermost surface, and side surfaces between the uppermost surface and the lowermost surface, the uppermost surface being closer to the gate structure than the lowermost surface, and
wherein the STI structure is completely enclosed by the drift region except for the uppermost surface of the STI structure.
2. The LDMOS device of claim 1 , wherein a doping concentration of the buried layer is on the same order as a doping concentration of the well region.
3. The LDMOS device of claim 1 , wherein doping concentrations of the source region and the drain region are higher than doping concentrations of the body region and the drift region.
4. The LDMOS device of claim 1 , wherein the buried layer is spaced apart from a bottom surface of the STI structure.
5. The LDMOS device of claim 1 , wherein the first conductive type is P-type and the second conductive type is N-type.
6. The LDMOS device of claim 1 , wherein the first conductive type is N-type and the second conductive type is P-type.
7. The LDMOS device of claim 1 , further including a body contact region having the first conductive type in the body region, in contact with the source region, and on one side of the source region opposite to the drift region.