IP Library › Granted Patent US 9,270,236
Granted Patent B2
US 9,270,236 · App. 14/269,267 · Granted Feb 23, 2016

Power amplifier

Inventors: Shintaro Watanabe (Tokyo, JP); Kazuhiro Iyomasa (Tokyo, JP)
Assignee: MITSUBISHI ELECTRIC CORPORATION
H03F1/565H03F3/195H03F3/245H03F2200/165H03F2200/222
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Quick Facts
Patent No.
US 9,270,236
App. No.
14/269,267
Granted
Feb 23, 2016
Kind
B2
Abstract

A power amplifier is smaller in size and limits input noise having a differential frequency. A power amplifier has an input terminal, an amplifying transistor, a bias circuit, a filter circuit, and an impedance matching circuit. The bias circuit supplies a bias to the signal input side of the amplifying transistor. The filter circuit removes noise at the signal input side of the amplifying transistor. The filter circuit has a matching resistor, a chip inductor, and a chip capacitor. Each of the chip inductor and the chip capacitor is a surface mount device. The matching resistor is located on a semiconductor substrate, has a first end connected to a connection point of two MIM capacitors, and a second end connected to a connection point of one of the MIM capacitors and the signal input side of the amplifying transistor.

Claims (59)

1. A power amplifier comprising:

a semiconductor substrate;

an input terminal;

an amplifying transistor located on the semiconductor substrate, amplifying a signal from the input terminal, and outputting an amplified signal to an output terminal;

a bias circuit supplying a bias to a signal input side of the amplifying transistor;

a filter circuit, including at least one of a chip inductor and a chip capacitor, removing noise at the signal input side of the amplifying transistor; and

an impedance matching circuit including

a matching resistor located on the semiconductor substrate, between the input terminal and the signal input side of the amplifying transistor,

a first capacitor located on the semiconductor substrate, wherein a first end of the first capacitor is connected to the input terminal, and

a second capacitor located on the semiconductor substrate, wherein

a first end of the second capacitor is connected to a second end of the first capacitor,

a second end of the second capacitor is connected to the signal input side of the amplifying transistor,

a first end of the matching resistor is connected to a connection point of the first capacitor and the second capacitor, and

a second end of the matching resistor is connected to a connection point of the second capacitor and the signal input side of the amplifying transistor.

2. The power amplifier according to claim 1 , wherein

the matching resistor includes:

a first resistor, wherein a first end of the first resistor is connected to the second end of the first capacitor, and

a second resistor, wherein a first end of the second resistor is connected to a second end of the first resistor, a second end of the second resistor is connected to the second end of the second capacitor; and

the bias circuit is connected to a connection point of the first resistor and the second resistor, and supplies the bias to the connection point.

3. The power amplifier according to claim 1 , wherein

the filter circuit is a serial LC resonance circuit including both of the chip inductor and the chip capacitor, connected in series to each other, and

a first end of the serial LC resonance circuit is connected to a connection point of the first capacitor and the matching resistor, a second end of the serial LC resonance circuit is connected to ground.

4. The power amplifier according to claim 1 , wherein

the filter circuit is a LC resonance circuit including both of the chip inductor and the chip capacitor, wherein a first end of the chip inductor is electrically connected to the input terminal, a first end of the chip capacitor is connected to a connection point of the chip inductor and the chip capacitor, and a second end of the chip capacitor is connected to ground; and

a first end of the matching resistor is connected to the first end of the chip inductor, and a second end of the matching resistor is connected to the signal input side of the amplifying transistor.

5. The power amplifier according to claim 1 , wherein the filter circuit includes:

a resistor located on the semiconductor substrate, wherein a first end of the resistor is connected to a connection point of the bias circuit and the signal input side of the amplifying transistor; and

the chip capacitor, wherein a first end of the chip capacitor is connected to a second end of the resistor, and a second end of the chip capacitor is connected to ground.

6. A power amplifier comprising:

a semiconductor substrate;

an input terminal;

an amplifying transistor located on the semiconductor substrate, amplifying a signal from the input terminal, and outputting an amplified signal to an output terminal;

a bias circuit supplying a bias to a signal input side of the amplifying transistor;

an impedance matching circuit located between the input terminal and the signal input side of the amplifying transistor, wherein the impedance matching circuit includes an inductor and a capacitor that are located on the semiconductor substrate; and

a filter circuit including a resistor and a chip capacitor located on the semiconductor substrate, wherein

the resistor and the chip capacitor are connected in series to each other, and

a first end of the filter circuit is connected to a connection point of the bias circuit and the signal input side of the amplifying transistor, and a second end of the filter circuit is connected to ground.

7. The power amplifier according to claim 1 , wherein the power amplifier is a multiband power amplifier in which a plurality of input signals in a plurality of bands are amplified by the amplifying transistor.

8. The power amplifier according to claim 1 , wherein

the amplifying transistor, the bias circuit, and the impedance matching circuit are integrated on the semiconductor substrate, and

the power amplifier further comprises:

a circuit substrate on which the semiconductor substrate and the at least one of the chip inductor and the chip capacitor are mounted; and

a package resin disposed on the circuit substrate encapsulating the semiconductor substrate and the at least one of the chip inductor and the chip capacitor.

9. The power amplifier according to claim 6 , wherein the power amplifier is a multiband power amplifier in which a plurality of input signals in a plurality of bands are amplified by the amplifying transistor.

10. The power amplifier according to claim 6 , wherein

the amplifying transistor, the bias circuit, and the impedance matching circuit are integrated on the semiconductor substrate, and

the power amplifier further comprises:

a circuit substrate on which the semiconductor substrate and the chip capacitor are mounted; and

a package resin disposed on the circuit substrate and encapsulating the semiconductor substrate and the chip capacitor.

11. A power amplifier comprising:

a semiconductor substrate;

an input terminal;

an amplifying transistor located on the semiconductor substrate, amplifying a signal from the input terminal, and outputting an amplified signal to an output terminal;

a bias circuit supplying a bias to a signal input side of the amplifying transistor;

a filter circuit, including at least one of a chip inductor and a chip capacitor, removing noise at the signal input side of the amplifying transistor; and

an impedance matching circuit including a matching resistor, wherein the matching resistor is located on the semiconductor substrate, between the input terminal and the signal input side of the amplifying transistor, wherein

the filter circuit includes

a resistor located on the semiconductor substrate, wherein a first end of the resistor is connected to a connection point of the bias circuit and the signal input side of the amplifying transistor, and

the chip capacitor, wherein a first end of the chip capacitor is connected to a second end of the resistor, and a second end of the chip capacitor is connected to ground.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2017
From: MITSUBISHI ELECTRIC CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 040839/0688 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2014
From: WATANABE, SHINTARO; IYOMASA, KAZUHIRO
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 032823/0212 →
Priority Claims (1)
JP 2013-188459 · Sep 11, 2013 · national
Continuity (1)
Related Publication 20150070096A1 · Mar 12, 2015