Semiconductor memory device
A semiconductor memory device comprises: first lines; second lines; memory cells; a first and second select gate transistor; and a control circuit. The first lines are arranged with a certain pitch in a first direction perpendicular to a substrate and are extending in a second direction parallel to the substrate. The second lines are arranged with a certain pitch in the second direction, are extending in the first direction, and intersect the plurality of first lines. The memory cells are disposed at intersections of the first lines and the second lines. The first and second select gate transistors each include a first or second channel line that are connected to a lower end or an upper end of the second line and a first or second gate line. The control circuit controls the first and second select gate transistors independently.
1. A semiconductor memory device, comprising:
a plurality of first lines that are arranged in a first direction perpendicular to a surface of a substrate and that are extending in a second direction parallel to the surface of the substrate;
a plurality of second lines that are arranged in the second direction, that are extending in the first direction, and that intersect the first lines;
a plurality of memory cells disposed at intersections of the first lines and the second lines;
a plurality of first select gate transistors each including a first channel line connected to a first end of the second line and a first gate line;
a first global bit line connected to the first channel lines;
a plurality of second select gate transistors each including a second channel line connected to a second end of the second line and a second gate line;
a second global bit line connected to the second channel lines; and
a control circuit that applies a voltage to the memory cells and that controls the first select gate transistors and the second select gate transistors, wherein
the control circuit sets one of the first select gate transistor and the second select gate transistor connected to a certain second line to an ON state and the other to an OFF state,
when the first select gate transistor connected to the certain second line is set to the ON state, the control circuit sets the first select gate transistor connected to the second line other than the certain second line to the OFF state, and sets the second select gate transistor connected to the second line other than the certain second line to the ON state, and
when the second select gate transistor connected to the certain second line is set to the ON state, the control circuit sets the first select gate transistor connected to the second line other than the certain second line to the ON state, and sets the second select gate transistor connected to the second line other than the certain second line to the OFF state.
2. The device according to claim 1 , wherein
the second channel line includes an oxide semiconductor.
3. The device according to claim 2 , wherein
the first end of the second line is provided on the side of the substrate, and the second end of the second line is provided on the side opposite to the side of the substrate.
4. The device according to claim 1 , wherein
the memory cells each comprise a stacked film including a silicon oxide film and an ion source metal.
5. The device according to claim 1 , further comprising:
a first insulating layer interposed between the first lines and the second lines; and
a second insulating layer interposed between the second channel line and the second gate line,
wherein the first insulating layer and the second insulating layer are formed in an integrated manner.
6. The device according to claim 1 , further comprising:
a first insulating layer interposed between the first lines and the second lines;
a second insulating layer interposed between the second channel line and the second gate line; and
a third insulating layer interposed between the first channel line and the first gate line,
wherein the first insulating layer, the second insulating layer, and the third insulating layer are formed in an integrated manner.
7. The device according to claim 1 , wherein
when the first select gate transistor connected to the certain second line is set to the ON state, the control circuit sets a voltage of the first global bit line to a setting voltage and a voltage of the second global bit line to a first voltage smaller than the setting voltage,
when the second select gate transistor connected to the certain second line is set to the ON state, the control circuit sets the voltage of the second global bit line to the setting voltage and the voltage of the first global bit line to the first voltage,
the control circuit sets a voltage of a certain first line to a second voltage smaller than the first voltage, and
the control circuit sets a voltage of the first line other than the certain first line to the first voltage.
8. The device according to claim 1 , wherein
the control circuit sets the first select gate transistor connected to the certain second line to the ON state and the second select gate transistor connected to the certain second line to the OFF state, and
the control circuit sets the first select gate transistor connected to the second line other than the certain second line to the OFF state, and sets the second select gate transistor connected to the second line other than the certain second line to the ON state.
9. The device according to claim 8 , wherein
the control circuit sets a voltage of the first global bit line to a setting voltage,
the control circuit sets a voltage of the second global bit line to a first voltage smaller than the setting voltage,
the control circuit sets a voltage of a certain first line to a second voltage smaller than the first voltage, and
the control circuit sets a voltage of the first line other than the certain first line to the first voltage.
10. The device according to claim 1 , wherein
the control circuit sets the second select gate transistor connected to the certain second line to the ON state and the first select gate transistor connected to the certain second line to the OFF state, and
the control circuit sets the first select gate transistor connected to the second line other than the certain second line to the ON state, and sets the second select gate transistor connected to the second line other than the certain second line to the OFF state.
11. The device according to claim 10 , wherein
the control circuit sets a voltage of the second global bit line to a setting voltage,
the control circuit sets a voltage of the first global bit line to a first voltage smaller than the setting voltage,
the control circuit sets a voltage of a certain first line to a second voltage smaller than the first voltage, and
the control circuit sets a voltage of the first line other than the certain first line to the first voltage.
12. A semiconductor memory device, comprising:
a plurality of first lines that are arranged in a first direction perpendicular to a surface of a substrate and that are extending in a second direction parallel to the surface of the substrate;
a plurality of second lines that are arranged in the second direction, that are extending in the first direction, and that intersect the first lines;
a plurality of memory cells disposed at intersections of the first lines and the second lines;
a plurality of first select gate transistors each including a first channel line connected to a first end of the second line and a first gate line;
a first global bit line connected to the first channel lines;
a plurality of second select gate transistors each including a second channel line connected to a second end of the second line and a second gate line;
a second global bit line connected to the second channel lines;
a first insulating layer interposed between the first lines and the second lines;
a second insulating layer interposed between the second channel line and the second gate line; and
a third insulating layer interposed between the first channel line and the first gate line,
the second channel line including an oxide semiconductor, and
the first insulating layer, the second insulating layer, and the third insulating layer are formed in an integrated manner.
13. The device according to claim 12 , wherein
the memory cells each comprise a stacked film of a silicon oxide film and an ion source metal.
14. The device according to claim 12 , wherein:
the first and second insulating layers are connected to each other, the first and third insulating layers are connected to each other, and the first to third insulating layers comprise the same material.
15. The device according to claim 12 , wherein,
the second channel line includes InO, ZnO, GaO, InGaZnO, CuO or TiO as the oxide semiconductor.
16. The device according to claim 12 , wherein
the first end of the second line is provided on the side of the substrate, and the second end of the second line is provided on the side opposite to the side of the substrate.
17. A semiconductor memory device, comprising:
a plurality of first lines that are arranged in a first direction perpendicular to a surface of a substrate and that are extending in a second direction parallel to the surface of the substrate;
a plurality of second lines that are arranged in the second direction, that are extending in the first direction, and that intersect the first lines;
a plurality of memory cells disposed at intersections of the first lines and the second lines;
a plurality of first select gate transistors each including a first channel line connected to a first end of the second line and a first gate line;
a first global bit line connected to the first channel lines;
a plurality of second select gate transistors each including a second channel line connected to a second end of the second line and a second gate line;
a second global bit line connected to the second channel lines;
a first insulating layer interposed between the first lines and the second lines;
a second insulating layer interposed between the second channel line and the second gate line; and
a third insulating layer interposed between the first channel line and the first gate line,
the memory cells each comprise a stacked film including a silicon oxide film and an ion source metal, and
the first insulating layer, the second insulating layer, and the third insulating layer are formed in an integrated manner.
18. The device according to claim 17 , wherein
the ion source metal includes silver (Ag) as the ion source metal.
19. The device according to claim 17 , wherein
the first and second insulating layers are connected to each other, and the first and third insulating layers are connected to each other, and the first to third insulating layers comprise the same material.
20. A semiconductor memory device, comprising:
a plurality of first lines that are arranged in a first direction perpendicular to a surface of a substrate and that are extending in a second direction parallel to the surface of the substrate;
a plurality of second lines that are arranged in the second direction, that are extending in the first direction, and that intersect the first lines;
a plurality of memory cells disposed at intersections of the first lines and the second lines;
a plurality of first select gate transistors each including a first channel line connected to a first end of the second line and a first gate line;
a first global bit line connected to the first channel lines;
a plurality of second select gate transistors each including a second channel line connected to a second end of the second line and a second gate line;
a second global bit line connected to the second channel lines;
a first insulating layer interposed between the first lines and the second lines;
a second insulating layer interposed between the second channel line and the second gate line; and
a third insulating layer interposed between the first channel line and the first gate line,
the second channel line including an oxide semiconductor, and
the first and second insulating layers are connected to each other, and the first and third insulating layers are connected to each other, and the first to third insulating layers comprise the same material.
21. The device according to claim 20 , wherein,
the second channel line includes InO, ZnO, GaO, InGaZnO, CuO or TiO as the oxide semiconductor.
22. The device according to claim 20 wherein
the first end of the second line is provided on the side of the substrate, and the second end of the second line is provided on the side opposite to the side of the substrate.
23. A semiconductor memory device, comprising:
a plurality of first lines that are arranged in a first direction perpendicular to a surface of a substrate and that are extending in a second direction parallel to the surface of the substrate;
a plurality of second lines that are arranged in the second direction, that are extending in the first direction, and that intersect the first lines;
a plurality of memory cells disposed at intersections of the first lines and the second lines;
a plurality of first select gate transistors each including a first channel line connected to a first end of the second line and a first gate line;
a first global bit line connected to the first channel lines;
a plurality of second select gate transistors each including a second channel line connected to a second end of the second line and a second gate line;
a second global bit line connected to the second channel lines;
a first insulating layer interposed between the first lines and the second lines;
a second insulating layer interposed between the second channel line and the second gate line; and
a third insulating layer interposed between the first channel line and the first gate line,
the memory cells each comprise a stacked film including a silicon oxide film and an ion source metal, and
the first and second insulating layers are connected to each other, and the first and third insulating layers are connected to each other, and the first to third insulating layers comprise the same material.
24. The device according to claim 23 , wherein,
the ion source metal includes silver (Ag) as the ion source metal.