IP Library Granted Patent US 9,275,739
Granted Patent B2
US 9,275,739 · App. 14/332,405 · Granted Mar 1, 2016

Semiconductor memory device, reading method, and programming method

Inventor: Masaru Yano (Tokyo, JP)
Assignee: Winbond Electronics Corp.
G11C16/10G11C16/0441G11C16/0483G11C16/26G11C16/28
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Quick Facts
Patent No.
US 9,275,739
App. No.
14/332,405
Granted
Mar 1, 2016
Kind
B2
Abstract

The invention provides a NAND-type semiconductor memory device capable of high speed operation. A semiconductor memory device of the invention includes: a memory array, which forms a plurality of memory cells arranged in a matrix direction; a vertical selecting mechanism, which couples to the memory array, and selects the memory cells in a vertical direction of the memory array according to a vertical address signal; a horizontal selecting mechanism, which couples to the memory array, and selects the memory cells in a horizontal direction of the memory array according to a horizontal address signal; and a controlling mechanism, which reads data from the memory cells or writes data into the memory cells. A plurality of cell units is disposed in the memory array. Each cell unit is consisted of a data memory cell which storages data and a reference memory cell which storages reference data.

Claims (36)

1. A semiconductor memory device, comprising:

a memory array, formed with a plurality of memory cells arranged in a matrix direction;

a vertical selecting mechanism, coupled to the memory array and selecting the memory cells in a vertical direction of the memory array according to a vertical address signal;

a horizontal selecting mechanism, coupled to the memory array and selecting the memory cells in a horizontal direction of the memory array according to a horizontal address signal; and

a controlling mechanism, reading data from the memory cells or writing data into the memory cells, wherein

a plurality of cell units is disposed in the memory array, each cell unit is consisted of a data memory cell for storing data and a reference memory cell for storing reference data, and one data memory cell is not adjacent to another data memory cell in both a vertical direction and a horizontal direction thereof, and

the controlling mechanism performs a reading operation, a programming operation or an erasing operation to one cell unit selected by the vertical selecting mechanism and the horizontal selecting mechanism.

2. The semiconductor memory device as recited in claim 1 , wherein the controlling mechanism comprises a sense circuit connected to a bit line of the memory cells, the data memory cell and the reference memory cell of the selected cell unit are simultaneously being read when performing a reading operation, and the sense circuit compares currents read from the data memory cell and the reference memory cell to determine the data stored in the data memory cell.

3. The semiconductor memory device as recited in claim 1 , wherein

when performing a programming operation, the controlling mechanism writes a value for determining the data in the data memory cell of the selected cell unit into the reference memory cell of the selected cell unit.

4. The semiconductor memory device as recited in claim 3 , wherein

the data memory cell writes a first reference data into the reference memory cell when storing a first data, and the data memory cell writes a second reference data different from the first reference data into the reference memory cell when storing a second data.

5. The semiconductor memory device as recited in claim 4 , wherein

the controlling mechanism writes the first data, the first reference data and the second reference data by applying a writing pulse.

6. The semiconductor memory device as recited in claim 4 , wherein

a written pulse number of the first reference data is less than a written pulse number of the first data, and a written pulse number of the second reference data is between the written pulse number of the first data and the written pulse number of the first reference data.

7. The semiconductor memory device as recited in claim 6 , wherein

when the written pulse number of the first data is N1, the written pulse number of the first reference data is R1, and the written pulse number of the second reference data is R2, then R1=N1−2 and R2=N1−1.

8. The semiconductor memory device as recited in claim 1 , wherein

the controlling mechanism performs an erasing operation to the memory array in units of blocks, and the controlling mechanism further reverses positions of the data memory cells and the reference memory cells in the cell units in a block underwent the erasing operation.

9. The semiconductor memory device as recited in claim 1 , wherein the memory array is a NAND flash memory array.

10. A reading method suitable for a semiconductor memory device, the semiconductor memory device comprising a memory array formed with a plurality of memory cells arranged in a matrix direction, the reading method comprising:

reading the memory array disposed with a plurality of cell units based on a vertical address information and a horizontal address information, wherein each cell unit is constituted of a data memory cell for storing data and a reference memory cell for storing reference data, and one data memory cell is not adjacent to another data memory cell in a vertical direction and a horizontal direction thereof; and

comparing currents read from the data memory cell and the reference memory cell of the selected cell unit to determine the data stored in the data memory cell.

11. A programming method suitable for a semiconductor memory device, the semiconductor memory device comprising a memory array formed with a plurality of memory cells arranged in a matrix direction, the writing method comprising:

programming the memory array disposed with a plurality of cell units based on a vertical address information and a horizontal address information, wherein each cell unit is constituted of a data memory cell for storing data and a reference memory cell for storing reference data, and one data memory cell is not adjacent to another data memory cell in a vertical direction and a horizontal direction thereof; and

writing the data memory cell of the selected cell unit according to a written data, and writing a value depending on the written data into the reference memory cell thereof.

12. The programming method as recited in claim 11 , wherein

writing a first reference data into the reference memory cell when storing a first data into the data memory cell, and writing a second reference data different from the first reference data into the reference memory cell when storing a second data into the data memory cell.

13. The programming method as recited in claim 12 , wherein

the first data, the first reference data and the second reference data are being written through applying a writing pulse.

14. The programming method as recited in claim 13 , wherein

a written pulse number of the first reference data is less than a written pulse number of the first data, a written pulse number of the second reference data is between the written pulse number of the first data and the written pulse number of the first reference data.

15. The programming method as recited in claim 14 , wherein

when the written pulse number of the first data is N1, the written pulse number of the first reference data is R1, and the written pulse number of the second reference data is R2, then R1=N1−2 and R2=N1−1.

16. The programming method as recited in claim 11 , wherein the memory array is a NAND flash memory array.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2014
From: YANO, MASARU
To: WINBOND ELECTRONICS CORP.
Reel/Frame 033357/0806 →
Priority Claims (1)
JP 2013-250787 · Dec 4, 2013 · national
Continuity (1)
Related Publication 20150155043A1 · Jun 4, 2015