Plasma treatment of film for impurity removal
Methods for plasma treatment of films to remove impurities are disclosed herein. Methods for removing impurities can include positioning a substrate with a barrier layer in a processing chamber, the barrier layer comprising a barrier metal and one or more impurities, maintaining the substrate at a bias, creating a plasma comprising a treatment gas, the treatment gas comprising an inert gas, delivering the treatment gas to the substrate to reduce the ratio of one or more impurities in the barrier layer, and reacting a deposition gas comprising a metal halide and hydrogen-containing gas to deposit a bulk metal layer on the barrier layer. The methods can further include the use of diborane to create selective nucleation in features over surface regions of the substrate.
1. A method for removing impurities, comprising:
positioning a substrate with a barrier layer in a processing chamber, the barrier layer comprising titanium nitride or tungsten nitride;
maintaining the substrate at a bias, wherein the bias is less than a sputtering bias for titanium nitride or tungsten nitride;
creating a plasma comprising a treatment gas, the treatment gas comprising an inert gas, wherein the plasma has an energy level which is less than a sputtering energy for titanium nitride or tungsten nitride;
delivering the treatment gas to an exposed portion of the barrier layer to create a titanium layer or tungsten layer respectively from the exposed portion, the titanium layer or the tungsten layer having a reduced ratio of nitrogen as compared to the titanium nitride or the tungsten nitride respectively; and
reacting a deposition gas comprising a tungsten halide or a titanium halide and a hydrogen-containing gas to deposit a bulk metal layer directly on the barrier layer.
2. The method of claim 1 , wherein the treatment gas comprises a gas selected from the group consisting of helium (He), neon (Ne), argon (Ar), krypton (Kr), gaseous hydrogen (H 2 ) or combinations thereof.
3. The method of claim 1 , further comprising maintaining the substrate at a first temperature during plasma treatment.
4. The method of claim 3 , wherein the first temperature is from 250° C. to 450° C.
5. The method of claim 1 , wherein the bias is an RF bias from 2 MHz to 60 MHz.
6. The method of claim 1 , wherein the bias is less than the sputter threshold of the barrier metal.
7. The method of claim 1 , wherein the plasma is created from an RF source with a frequency from 400 KHz to 60 Mhz.
8. The method of claim 1 , wherein the deposition gas comprises a tungsten halide, and wherein the tungsten halide is selected from the group consisting of tungsten hexafluoride (WF 6 ), tungsten hexachloride (WCl 6 ), and combinations thereof.
9. The method of claim 1 , wherein the deposition gas comprises a titanium halide, and wherein the titanium halide is selected from the group consisting of titanium tetrafluoride (TiF 4 ), titanium tetrachloride (TiCl 4 ), and combinations thereof.
10. The method of claim 1 , wherein the bulk metal layer is deposited at a temperature between 250° C. and 350° C.
11. The method of claim 1 , wherein the one or more impurities comprise nitrogen, oxygen, carbon or combinations thereof.
12. A method for removing impurities, comprising:
positioning a substrate in a processing chamber, the substrate comprising:
an upper surface having one or more features; and
a barrier layer formed over the upper surface and the one or more feature, where the barrier layer comprises tungsten and nitrogen;
creating a first plasma comprising a first treatment gas, the first treatment gas comprising an inert gas;
delivering the first treatment gas to the barrier layer to reduce the quantity of nitrogen in an exposed surface of the barrier layer;
exposing the barrier layer to diborane (B 2 H 6 ) gas to deposit a layer of adsorbed boron in the barrier layer;
creating a second plasma comprising a second treatment gas, the second treatment gas comprising an inert gas;
delivering the second treatment gas to the barrier layer while maintaining the substrate with a bias at a voltage less than the sputter threshold of the barrier metal to remove boron from the upper surface, wherein boron is maintained in the features;
exposing the barrier layer to a gas mixture comprising WF 6 to deposit a thin layer of tungsten preferentially in the features; and
reacting a deposition gas comprising a tungsten halide and hydrogen-containing gas to deposit a bulk tungsten layer on the thin layer of tungsten and the barrier layer.
13. The method of claim 12 , wherein the bias voltage is greater than the threshold required to strip adsorbed B 2 H 6 or boron.
14. The method of claim 12 , wherein the treatment gas comprises a gas selected from the group consisting of He, Ne, Ar, Kr, H 2 or combinations thereof.
15. The method of claim 12 , further comprising delivering a treatment bias while the substrate receives the first plasma.
16. The method of claim 15 , wherein the bias is an RF bias from 2 MHz to 60 MHz.
17. The method of claim 12 , wherein the plasma is created from an RF source with a frequency from 400 KHz to 60 Mhz.
18. The method of claim 12 , wherein the bulk metal layer is deposited at a temperature between 250° C. and 350° C.