Molecular self-assembly in substrate processing
Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, flouroalkyl groups, heteroarlyl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming.
1. A device comprising:
a substrate comprising at least a porous dielectric region; and
a pore sealing layer operable to seal the porous dielectric region, the pore sealing layer comprising an organosilane, wherein the organosilane comprises an organic group selected from the group consisting of: alkynyl groups, aryl groups, fluoroalkyl groups, heteroarlyl groups, amine groups, thiocarbamate groups, ester groups, sulfide groups, and nitrile groups;
a barrier layer formed over the pore sealing layer, wherein the barrier layer comprises a titanium-based material, a tantalum-based material, a ruthenium-bases material, or a tungsten-based material; and
wherein the organosilane comprises a hydrolysable group to facilitate attachment with the porous dielectric region, and wherein the hydrolysable group does not comprise an alkyl group.
2. The device of claim 1 , wherein the substrate further comprises a conductive region, and wherein the pore sealing compound is selectively deposited on the porous dielectric region and not on the conductive region.
3. The device of claim 1 , wherein the hydrolysable group is selected from the group consisting of: a halide, an amine, a heteroaryl, and a fluororoaryl.
4. A device comprising:
a substrate comprising at least a porous dielectric region and a conductive region; and
a pore sealing compound operable to seal the porous dielectric region, the pore sealing compound comprising a polymerizable organosilane and a halide to facilitate attachment with the porous dielectric, wherein the pore sealing compound is selectively deposited on the porous dielectric region and not on the conductive region;
further comprising a barrier layer formed over the pore sealing layer, wherein the barrier layer comprises a titanium-based material, a tantalum-based material, a ruthenium-bases material, or a tungsten-based material;
wherein the polymerizable organosilane is selected from the group consisting of: an dodecyldimethyl(methoxy)silane, a triethoxysilane, and C l2 H 25 SiCl 3 .
5. The device of claim the method of claim 4 , wherein the pore size is between 10 and 50 Angstroms.
6. A device comprising:
a substrate comprising at least a porous dielectric region; and
a pore sealing layer operable to seal the porous dielectric region, the pore sealing layer comprising an organosilane, wherein the organosilane comprises a hydrolysable amine for facilitating attachment with the porous dielectric region and dodecyldimethyl(methoxy)silane, a triethoxysilane, or C l2 H 25 SiCl 3 ; and
a barrier layer formed over the pore sealing layer, wherein the barrier layer comprises a titanium-based material, a tantalum-based material, a ruthenium-bases material, or a tungsten-based material.
7. The device of claim 6 , wherein the substrate is chosen from the group consisting of: integrated circuits, semiconductor devices, flat panel displays, optoelectronic devices, data storage devices, magnetoelectronic devices, magnetooptic devices, molecular electronic devices, solar cells, photonic devices, and packaged devices.