Method for manufacturing flexible display device

1. A method for manufacturing a flexible display device, comprising:

forming a separation layer on a carrier substrate;

laminating a flexible substrate having an area which is larger than that of the separation layer, to the separation layer;

forming a dummy pattern on and along an edge of the flexible substrate;

removing a portion of the flexible substrate having the area which is larger than that of the separation layer, at a side of the flexible substrate, to define the flexible substrate with the dummy pattern thereon to have an area smaller than that of the separation layer,

wherein the flexible substrate having the smaller than that of the separation layer exposes a portion of the separation layer, the exposed portion of the separation layer extended further than an edge of the flexible substrate having the area smaller than that of the separation layer; and

separating the separation layer and the extended portion thereof from the flexible substrate having the area smaller than that of the separation layer.

2. The method of claim 1 , wherein

the carrier substrate and the flexible substrate comprise glass, and

the flexible substrate has a cross-sectional thickness which is smaller than that of the carrier substrate.

3. The method of claim 2 , wherein the separation layer comprises a metal oxide comprising aluminum zinc oxide.

4. The method of claim 3 , wherein the separation layer has

a thickness of about 50 angstroms to about 300 angstroms and

surface roughness of about 6 angstroms to about 15 angstroms.

5. The method of claim 1 , wherein

in the exposing the portion of the separation layer, the flexible substrate is cut along a first cutting line,

wherein the first cutting line

is spaced apart from an edge of the separation layer at the side of the flexible substrate, and

is aligned with an edge of the separation layer at remaining sides of the flexible substrate except for the side of the flexible substrate at which the portion of the separation layer is removed.

6. The method of claim 5 , further comprising

removing a portion of the carrier substrate by cutting the carrier substrate along a second cutting line,

wherein the second cutting line is aligned with the edge of the separation layer at each side of the flexible substrate.

7. The method of claim 1 , wherein in the separating the separation layer and the extended portion thereof from the flexible substrate having the area smaller than that of the separation layer, a stripping apparatus is inserted between the extended portion of the separation layer and the edge of the flexible substrate having the area smaller than that of the separation layer.

8. The method of claim 1 , wherein

in the forming the dummy pattern, a display unit comprising a plurality of layers is formed inside the dummy pattern, and

the dummy pattern is formed of a same material as a layer among the plurality of layers of the display unit.

9. The method of claim 8 , wherein

the display unit and the dummy pattern overlap the separation layer, and

an edge of an external side of the dummy pattern is inside an edge of an external side of the separation layer.

10. The method of claim 9 , wherein the dummy pattern comprises at a same side of the display unit, an internal dummy pattern portion, and an external dummy pattern portion closer to the edge of the external side of the separation layer than the internal dummy pattern portion.

11. The method of claim 8 , wherein

the display unit comprises a thin film transistor and an organic light emitting diode,

the thin film transistor comprises a semiconductor layer, a gate electrode and source and drain electrodes, and

the organic light emitting diode comprises a pixel electrode, an organic light emitting layer and a common electrode.

12. The method of claim 11 , wherein the dummy pattern is formed of a same material as the gate electrode or the source and drain electrodes.

13. The method of claim 11 , wherein

the dummy pattern comprises:

a first layer formed of a same material as the gate electrode; and

a second layer formed of a same material as the source and drain electrodes.

14. The method of any one of claim 1 , wherein,

in the forming the dummy pattern, a touch sensor unit comprising a plurality of layers is formed inside the dummy pattern, and

the dummy pattern is formed of a same material a layer among the plurality of layers of of the touch sensor unit.

15. The method of claim 14 , wherein

the touch sensor unit and the dummy pattern overlap the separation layer, and

an edge of an external side of the dummy pattern is inside an edge of an external side of the separation layer.

16. The method of claim 15 , wherein the dummy pattern comprises at a same side of the touch sensor unit, an internal dummy pattern portion, and an external dummy pattern portion closer to the edge of the external side of the separation layer than the internal dummy pattern portion.

17. The method of claim 14 , wherein

the touch sensor unit comprises:

first sensing patterns continuously extended in a first direction;

discrete second sensing patterns arranged in a second direction crossing the first direction, and electrically connected to each other by a connection pattern; an

a plurality of wires connected to the first sensing patterns and the second sensing patterns.

18. The method of claim 17 , wherein the dummy pattern is formed of a same material as the first sensing patterns, the second sensing patterns, the connection pattern or the plurality of wires.

19. The method of claim 17 , wherein

the touch sensor unit comprises:

an insulating layer covering the first sensing patterns and the second sensing patterns, and a via hole defined in the insulating layer, and

a protective layer covering the connection pattern,

wherein the connection pattern is connected to the second sensing patterns through the via hole.

20. The method of claim 19 , wherein

the dummy pattern comprises:

a first layer formed of a same material as the first sensing patterns and the second sensing patterns;

a second layer formed of a same material as the insulating layer;

a third layer formed of a same material as the connection pattern; and

a fourth layer formed of a same material as the protective layer.