Multilayer ceramic electronic component and manufacturing method thereof
There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.
1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer;
first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layer interposed therebetween; and
first and second external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes,
wherein the first and second internal electrodes are exposed to both end surfaces of the ceramic body, the first internal electrode includes a first oxide layer formed inwardly from one end surface of the ceramic body in a length direction and a first interlayer formed adjacently to the first oxide layer, and the second internal electrode includes a second oxide layer formed inwardly from the other end surface of the ceramic body in the length direction and a second interlayer formed adjacently to the second oxide layer, and
the first interlayer contains a metal having an ionization tendency higher than that of a metal contained in a remaining region of the first internal electrode, or contains a metal more easily oxidized than the metal contained in the remaining region of the first internal electrode, in a solid solution form, as well as the metal contained in the remaining region of the first internal electrode, and the second interlayer contains a metal having an ionization tendency higher than that of a metal contained in a remaining region of the second internal electrode or contains a metal more easily oxidized than the metal contained in the remaining region of the second internal electrode, in a solid solution form, as well as the metal contained in the remaining region of the second internal electrode.
2. The multilayer ceramic electronic component of claim 1 , wherein a width La of at least one of the first and second oxide layers is 5 to 30 μm inwardly from at least one of the both end surfaces of the ceramic body in the length direction.
3. The multilayer ceramic electronic component of claim 1 , wherein a width Lb from at least one of the both end surfaces of the ceramic body to at least one of the first and second interlayers is equal to or greater than a width La of at least one of the first and second oxide layers and is 5 μm or more.
4. The multilayer ceramic electronic component of claim 1 , wherein when Lc is defined as a difference (Lc=L−Lb) between a length L of the ceramic body and a width Lb from at least one of the both end surfaces of the ceramic body to at least one of the first and second interlayers, Lc is 5 μm or more.
5. The multilayer ceramic electronic component of claim 1 , wherein the first and second interlayers contain at least one selected from a group consisting of chromium (Cr), tungsten (W), molybdenum (Mo), magnesium (Mg), manganese (Mn), copper (Cu), and nickel (Ni).
6. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes contain at least one selected from a group consisting of nickel (Ni), copper (Cu), palladium (Pd), and a palladium-silver (Pd-Ag) alloy.