Printed circuit board and method for manufacturing the same

1. A printed circuit board including a cavity, the printed circuit board comprising:

a base substrate;

an insulating layer on the base substrate and including the cavity;

a circuit layer on the base substrate and including a first circuit pattern buried in the insulating layer and a second circuit pattern exposed by the cavity;

a cavity separation pattern on the base substrate, buried in the insulating layer, and surrounding the cavity; and

a solder resist pattern on the base substrate;

wherein the solder resist pattern comprises:

a first solder resist pattern on the base substrate and exposed by the cavity; and

a second solder resist pattern on the base substrate and buried in the insulating layer;

wherein the cavity separation pattern is formed on the second solder resist pattern buried in the insulating layer.

2. The printed circuit board of claim 1 , wherein the base substrate comprises a groove formed along a boundary region of the cavity.

3. The printed circuit board of claim 1 , wherein side surfaces of the second solder resist pattern and the cavity separation pattern are exposed by the cavity.

4. The printed circuit board of claim 1 , further comprising:

a surface treatment layer on the second circuit pattern exposed by the cavity,

wherein a top surface of the solder resist pattern lies in the same plane as a top surface of the surface treatment layer.

5. The printed circuit board of claim 1 , wherein the circuit layer includes an etch stop pattern formed at a boundary region of the cavity, and the insulating layer buries a portion of the etch stop pattern.

6. The printed circuit board of claim 5 , wherein the cavity separation pattern is formed on a portion of the etch stop pattern buried in the insulating layer.

7. The printed circuit board of claim 5 , wherein a remaining region of the etch stop pattern is exposed by the cavity.

8. The printed circuit board of claim 5 , wherein the cavity separation pattern represents weaker adhesion strength with the etch stop pattern than adhesion strength with the insulating layer.

9. A method for manufacturing a printed circuit board, the method comprising:

forming a base circuit board including a first circuit pattern outside a cavity region and a second circuit pattern in the cavity region;

forming a solder resist pattern on the cavity region of the base circuit board;

forming a cavity separation layer on the second circuit pattern;

forming an insulating layer on the base circuit board;

cutting the insulating layer and the cavity separation layer by controlling a focal length of a laser beam such that the laser beam reaches up to a surface of the base circuit board; and

removing the insulating layer by separating the cavity separation layer to form the cavity;

wherein the cavity separation layer has a width wider than a width of the cavity region,

wherein a portion of the cavity separation layer is buried in the insulating layer and surrounds the cavity;

wherein the solder resist pattern comprises:

a first solder resist pattern on the base substrate and exposed by the cavity; and

a second solder resist pattern on the base substrate and buried in the insulating layer; and

wherein a portion of the cavity separation layer is formed on the second solder resist pattern buried in the insulating layer.

10. The method of claim 9 , wherein the base circuit board includes a plurality of second circuit patterns in the cavity region, and

wherein the solder resist pattern is formed between the second circuit patterns.

11. The method of claim 9 , further comprising forming an oxide layer on an upper portion of the second circuit pattern.

12. The method of claim 9 , wherein the cutting the insulating layer includes irradiating the laser beam to the base circuit board by controlling the focal length of the laser beam such that a groove is formed in the surface of the base circuit board.

13. The method of claim 11 , wherein side surfaces of the second solder resist pattern and the portion of the cavity separation layer are exposed by the cavity.

14. The method of claim 11 , wherein a top surface of the solder resist pattern lies in the same plane as a top surface of the oxide layer.

15. A method of manufacturing a printed circuit board including a cavity, the method comprising:

forming a base circuit board including a first circuit pattern outside a cavity region, a second circuit pattern in the cavity region, and a third circuit pattern along an edge of the cavity region;

forming a solder resist pattern on the cavity region of the base circuit board;

forming an oxide layer on the second circuit pattern;

forming a cavity separation layer on the second circuit pattern and the third circuit pattern;

forming an insulating layer on the base circuit board;

cutting the insulating layer and the cavity separation layer on the third circuit pattern through laser drilling; and

forming the cavity by removing the insulating layer which is cut as the cavity separation layer is separated from the third circuit pattern;

wherein the cavity separation layer has a width wider than a width of the cavity region,

wherein a portion of the cavity separation layer is buried in the insulating layer, and

wherein a top surface of the solder resist pattern lies in the same plane as a top surface of the oxide layer.

16. The method of claim 15 , wherein a side surface of the buried portion of the cavity separation layer is exposed by the cavity.

17. The method of claim 15 , wherein the forming the cavity separation layer includes attaching an insulating tape onto the third circuit pattern and the second circuit pattern.