Stand-off block
An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
1. An apparatus comprising:
a substrate comprising an electric chip;
a circuit board;
a ball grid array structure disposed between the substrate and the circuit board, the ball grid array structure configured to electrically connect the electric chip to the circuit board; and
a stand-off structure disposed on the circuit board between the substrate and the circuit board, the stand-off structure being adjacent to the ball grid array structure wherein a gap is disposed between the stand-off structure and the substrate.
2. The apparatus of claim 1 , wherein the substrate comprises a ball grid array component.
3. The apparatus of claim 1 , wherein the circuit board comprises a printed circuit board.
4. The apparatus of claim 1 , wherein the ball grid array structure comprises:
a ball grid array structure pad;
a ball grid array structure solder section; and
a solder ball.
5. The apparatus of claim 1 , wherein the stand-off structure comprises:
a stand-off structure pad;
a stand-off structure solder section; and
a block.
6. The apparatus of claim 5 , wherein the block has a diameter in a range from about 23 mils to about 25 mils.
7. The apparatus of claim 5 , wherein the block has a diameter in a range from about 29 mils to about 31 mils.
8. The apparatus of claim 5 , wherein the block has a height in a range from about 7 mils to about 9 mils.
9. The apparatus of claim 5 , wherein the block has a height in a range from about 10 mils to about 12 mils.
10. The apparatus of claim 5 , wherein the block has a height in a range from about 11 mils to about 13 mils.
11. The apparatus of claim 5 , wherein the block has a height in a range from about 15 mils to about 17 mils.
12. The apparatus of claim 5 , wherein the block comprises nickel plated with gold.
13. The apparatus of claim 5 , wherein the block comprises copper plated with tin and gold.
14. The apparatus of claim 5 , wherein the block comprises copper plated with tin and gold on a top surface of the block and on a bottom surface of the block.
15. The apparatus of claim 1 , wherein the stand-off structure is disposed at corner of a ball grid array in which the ball grid array structure is disposed.