Silane/urea compound as a heat-activated curing agent for epoxide resin compositions

1. A thermosetting epoxy resin composition comprising:

at least one epoxy resin EH having, on average, more than one epoxide group per molecule; and

at least one silane of formula (I);

wherein A is an optionally branched alkylene group containing 1 to 4 C atoms, or a phenylene group;

wherein Z 1 is H or an alkyl group containing 1 to 4 C atoms;

wherein Z 2 is H, a phenyl group, or an alkyl group containing 1 to 8 C atoms;

wherein Z 3 is:

H,

a monofunctional aromatic or cycloaliphatic or aliphatic group containing 1 to 8 C atoms, which optionally contains at least one carboxylate, nitrile, nitro, phosphonate, or sulfonic or sulfonate group, or

a group having a formula of A-Si(Z 2 ) 3-a (OZ 1 ) a ;

wherein Z 4 is H or a monofunctional aromatic or cycloaliphatic or aliphatic group containing 1 to 8 C atoms;

wherein Z 5 is:

a bi-functional aromatic or araliphatic or cycloaliphatic or aliphatic group containing 1 to 40 C atoms, or

a group having a formula of A-Si(Z 2 ) 3-a (OZ 1 ) a ;

wherein X is O or S;

wherein a is 1 or 2 or 3; and

wherein b is 1 or 2 or 3 or 4;

with the proviso that either Z 3 or Z 4 is H.

2. The thermosetting epoxy resin composition of claim 1 , wherein the silane of formula (I) is present on the surface of an inorganic filler.

3. The thermosetting epoxy resin composition of claim 2 , wherein the inorganic filler contains at least one metal atom selected from the group consisting of Ca atoms, Si atoms, Al atoms, and mixtures thereof.

4. The thermosetting epoxy resin composition of claim 3 , wherein the silane of formula (I) is coated onto the surface of the inorganic filler.

5. The thermosetting epoxy resin composition of claim 3 , wherein the silane of formula (I) is chemically bound with the inorganic filler.

6. The thermosetting epoxy resin composition of claim 1 , wherein the silane of formula (I) is present in the thermosetting epoxy resin composition in amount of from 0.001-20% by weight, relative to the weight of the thermosetting epoxy resin composition.

7. The thermosetting epoxy resin composition of claim 1 , further comprising at least one heat-activatable curing agent B selected from the group consisting of dicyandiamide, guanamine, guanidine, aminoguanidine, a substituted urea, a phenyldimethyl urea, imidazoles, imidazole salts, imidazolines, amine complexes and derivatives thereof.

8. The thermosetting epoxy resin composition of claim 1 , wherein the thermosetting epoxy resin composition further comprises at least one impact modifier D.

9. The thermosetting epoxy resin composition of claim 8 , wherein the impact modifier D is selected from the group consisting of blocked polyurethane polymers, liquid rubbers, epoxy resin-modified liquid rubbers, block copolymers, and core-shell polymers.

10. The thermosetting epoxy resin composition of claim 9 , wherein the impact modifier D is a blocked polyurethane polymer of formula (IV)

wherein:

Y 1 is a linear or branched polyurethane polymer PU1, terminated by m+m′ isocyanate groups, after removal of all end-position isocyanate groups;

Y 2 is independently a blocking group that cleaves at a temperature above 100° C.;

Y 3 is independently a group of formula (IV′)

wherein R 4 is a radical of an aliphatic, cycloaliphatic, aromatic, or araliphatic epoxy, containing a primary or secondary hydroxyl group, after removal of the hydroxide and epoxy groups;

wherein p is 1, 2, or 3, and

wherein m and m′ each stand for an integer between 0 and 8, with the proviso that a value of m+m′ is from 1 to 8.

11. A method for the adhesive bonding of heat-stable substrates, the method comprising:

i) applying the thermosetting epoxy resin composition of claim 1 to a surface of a first heat-stable substrate S1;

ii) contacting the applied thermosetting epoxy resin composition with the surface of second heat-stable substrate S2; and

iii) heating the contacted thermosetting epoxy resin composition to a temperature of 100-220° C.;

wherein substrate S2 is composed of a material that is identical to or different from substrate S1.

12. A cured epoxy resin composition obtained by heating the thermosetting epoxy resin composition claim 1 .