Optical circuit board

1. An optical circuit board comprising:

a top face,

a bottom face,

an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,

an opto-electronic component adapted to emit or receive light transmitted through said optical layer,

a solid heat dissipative element adapted to dissipate heat, generated at the opto-electronic component, and

a cavity extending between the top and bottom faces, wherein the solid heat dissipative element is mounted in the cavity from the bottom face.

2. Optical circuit board according to claim 1 , wherein the heat dissipative element is a heat spreader.

3. Optical circuit board according to claim 1 , wherein the heat dissipative element is a heat sink.

4. Optical circuit board according to claim 1 , wherein the heat dissipative element is directly fixed to the optical circuit board.

5. Optical circuit board according to claim 1 , wherein the opto-electronic component is directly fixed to the solid heat dissipative element.

6. Optical circuit board according to claim 1 , wherein the opto-electronic component is fixed to the solid heat dissipative element through a heat-dissipative printed circuit board substrate.

7. Optical circuit board according to claim 6 , wherein the heat-dissipative printed circuit board substrate is made of ceramics.

8. An optical circuit board having a body comprising:

a top face,

a bottom face,

an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,

an optical engine fixed to the body and comprising:

a heat-dissipating printed circuit board substrate made of ceramics,

an opto-electronic component carried by the substrate and adapted to emit or receive light transmitted through said optical layer,

a control component carried by the substrate, electrically connected to the optoelectronic component on the substrate,

a solid heat sink fixed to the heat-dissipating printed circuit board substrate and adapted to dissipate heat generated at the opto-electronic component, and

a cavity extending between the top and bottom faces, wherein the solid heat sink is mounted in the cavity from the bottom face.

9. Optical circuit board according to claim 1 further comprising a cover mounted to the top face adapted to seal the cavity.

10. Optical circuit board according to claim 1 , wherein the opto-electronic component and/or the heat dissipative element are located between the top and bottom faces.

11. An optical circuit board comprising:

a top face,

a bottom face,

a cavity extending between the top and the bottom faces,

an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,

an opto-electronic component adapted to emit or receive light transmitted through said optical layer,

a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component, mounted in the cavity from the bottom face, wherein the solid heat dissipative element is mounted in the cavity from the bottom face, and

a cover mounted to the top face adapted to seal the cavity.

12. Optical circuit board according to claim 1 , further comprising an optical coupling device adapted to optically couple the opto-electronic component to the buried optical layer.

13. Optical circuit board according to claim 12 , wherein the optical coupling device comprises a mirror adapted to deflect light between the opto-electronic component and the buried optical layer.

14. Optical circuit board according to claim 12 , wherein the optical coupling device comprises a light-beam forming structure adapted to optically couple the opto-electronic component to the buried optical layer.

15. An optical circuit board comprising:

a top face,

a bottom face,

an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,

an opto-electronic component adapted to emit or receive light transmitted through said optical layer,

a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component,

an optical coupling device adapted to optically couple the opto-electronic component to the buried optical layer, and

a cavity extending between the top and bottom faces, wherein the solid heat dissipative element is mounted in the cavity from the bottom face,

wherein the optical coupling device comprises a mirror adapted to deflect light between the opto-electronic component and the buried optical layer, wherein the optical coupling device comprises a light-beam forming structure adapted to optically couple the opto-electronic component to the buried optical layer.

16. Optical circuit board according to claim 14 , wherein the light-beam forming structure is adapted to optically couple the opto-electronic component to the optical coupling device and/or wherein the light-beam forming structure is adapted to optically couple the buried optical layer to the optical coupling device.

17. Optical circuit board according to claim 1 , comprising at least one optical waveguide buried between said bottom and top faces, said optical waveguide being adapted to transmit optical signals, comprising at least one opto-electronic component adapted to emit light transmitted through one optical waveguide and comprising at least one opto-electronic component adapted to receive light transmitted through one optical waveguide.

18. Optical circuit board according to claim 1 , comprising a single optical coupling device adapted to optically couple the opto-electronic components to the buried optical layer(s).

19. Optical circuit board according to claim 1 , further comprising an electrically conductive layer, and wherein the opto-electronic component is electrically connected to the electrically conductive layer through wire bonding.