Chip size package (CSP)
A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.
1. A chip size package (CSP) comprising
an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps,
wherein the antenna is connected to a circuit provided outside the CSP, and
the wiring of the rewiring layer configuring the antenna has ends formed at positions where the solder bumps are formed.
2. The CSP according to claim 1 , wherein
the antenna is connected to a circuit provided inside the CSP, and
the wiring of the rewiring layer configuring the antenna is formed at a position where the solder bumps are not formed.
3. A chip size package (CSP) comprising
an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps,
wherein the CSP is mounted on a mounting substrate, and
a part of the mounting substrate corresponding to the wiring of the rewiring layer configuring the antenna is hollowed, and a hole is provided at the hollowed part.
4. The CSP according to claim 3 , wherein a horn antenna is provided at a position corresponding to the hole of the mounting substrate.
5. A chip size package (CSP) comprising
an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps, and
wherein the CSP is configured as an image sensor.