Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product
An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz≧Tgy+20° C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.
1. A curable resin composition comprising:
(A) a thermoplastic resin,
(B) a thermosetting component,
(C) an alkali-soluble component, and
at least one compound selected from the group consisting of (D-1) a photopolymerization initiator and (D-2) a photo-base generator,
wherein
the thermoplastic resin (A) has two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and
the thermosetting component (B) has a glass transition point Tgz, which satisfies Tgz≧Tgy+20° C.
2. The curable resin composition according to claim 1 , wherein a cured product obtained by curing the curable resin composition includes a nanocylinder structure therein.
3. The curable resin composition according to claim 1 , wherein the thermosetting component (B) is an epoxy compound.
4. The curable resin composition according to claim 1 , wherein the alkali-soluble component (C) is a carboxyl group-containing resin or a phenolic hydroxy group-containing resin.
5. The curable resin composition according to claim 1 , further comprising a heat-curing catalyst (E).
6. A cured product obtained by photoirradiation and subsequent thermal curing of the curable resin composition according to claim 1 .
7. The cured product according to claim 6 , wherein the cured product has a nanocylinder structure.
8. A printed circuit board comprising the cured product according to claim 6 .
9. A process for manufacturing a cured product of a curable resin composition, comprising:
(a) coating a substrate with the curable resin composition according to claim 1 and drying the curable resin composition,
(b) applying a pattern-wise light to the curable resin composition to activate a photopolymerization initiator included in the curable resin composition to cure the photo-irradiated part, and
(c) removing a non-irradiated part by development to form a negative-type patterned layer.
10. The process for manufacturing a cured product of a curable resin composition according to claim 9 , further comprising (d) further light application.
11. The curable resin composition according to claim 1 , comprising (D-1) the photopolymerization initiator.
12. The curable resin composition according to claim 1 , comprising (D-2) the photo-base generator.
13. The curable resin composition according to claim 1 , comprising both (D-1) the photopolymerization initiator and (D-2) the photo-base generator.