IP Library › Granted Patent US 9,298,227
Granted Patent B2
US 9,298,227 · App. 13/893,644 · Granted Mar 29, 2016

Full height I/O bracket for low profile expansion card

Inventors: Chih-Hsiang Lee (Taoyuan, TW); Yao-Chien Lien (Taipei, TW); Hsien-Chih Wu (Chang-Chung, TW); Chien Hung Chou (Taipei, TW); Kuo-Chih Lin (Taipei, TW); Martin Hardis (Taipei, TW)
Assignee: Dell Products, L.P.
G06F1/185G06F1/188Y10T29/49124
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,298,227
App. No.
13/893,644
Filed
May 14, 2013
Granted
Mar 29, 2016
Kind
B2
Art Unit
2837
USPC
361/679.46
Abstract

An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.

Claims (37)

1. An expansion card for an information handling system, the expansion card comprising:

a mounting bracket comprising a full height input/output (I/O) panel sized for insertion in an I/O panel frame of an enclosure and comprising a top mounting panel attached to the full height I/O panel and extending orthogonally away from the full height I/O panel; and

a low profile printed circuit board assembly (PCBA) physically attached to at least one of the top mounting panel and the full height I/O panel, wherein the mounting bracket and the low profile PCBA define a full height expansion card; and

a full height heat sink attached to the low profile PCBA and extending across a portion of the top mounting panel to provide increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA.

2. The expansion card of claim 1 , further comprising a mounting plate positioned on a back side of the low profile PCBA and fastened through at least two holes in the low profile PCBA to the full height heat sink.

3. The expansion card of claim 1 , wherein the low profile PCBA further comprises a processing component that generates heat dissipated by the full height heat sink, wherein the expansion card further comprises a battery space on the top mounting panel and a battery compartment attachable to the top mounting panel within the battery space and in electrical communication with the processing component.

4. The expansion card of claim 1 , wherein the low profile PCBA comprises a pair of mounting holes spaced for attachment to upper and lower tabs of a low profile I/O panel, and wherein the full height I/O panel of the mounting bracket comprises a pair of tabs presenting respective mounting holes identically positioned to the low profile I/O panel.

5. The expansion card of claim 4 , wherein the at least two holes through the low profile PCBA are identically spaced to at least two holes on a low profile heat sink to enable interchangeability.

6. The expansion card of claim 5 , wherein an unattached lengthwise edge of the top mounting panel comprises an embossed surface to frictionally engage a card holder of a device in which the card is inserted.

7. The expansion card of claim 1 , wherein the full height I/O panel and the top mounting panel comprises a single sheet metal stamping part.

8. An information handling system, comprising:

an enclosure having at least one input/output (I/O) connector in communication with enclosed components of the information handling system;

an I/O panel frame attached across an opening in the enclosure; and

an expansion card communicatively coupled to an I/O connector at the I/O panel frame and comprising:

a mounting bracket comprising a full height I/O panel sized for insertion in the I/O panel frame and comprising a top mounting panel attached to the full height I/O panel and extending orthogonally away from the full height I/O panel;

a low profile printed circuit board assembly (PCBA) physically attached to at least one of the top mounting panel and the full height I/O panel, wherein the mounting bracket and low profile PCBA define a full height expansion card, the low profile PCBA having a card edge insertably connectable to a selected one I/O connector to communicate with the enclosed components; and

a full height heat sink attached to the low profile PCBA and extending across a portion of the top mounting panel to provide increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA.

9. The information handling system of claim 8 , wherein the expansion card further comprises a mounting plate positioned on a back side of the low profile PCBA and fastened through at least two holes in the low profile PCBA to the full height heat sink.

10. The information handling system of claim 8 , wherein the low profile PCBA of the expansion card further comprises a processing component that generates heat dissipated by the full height heat sink, wherein the expansion card further comprises a battery space on the top mounting panel and a battery compartment attachable to the top mounting panel within the battery space and in electrical communication with the processing component.

11. The information handling system of claim 8 , wherein the low profile PCBA of the expansion card comprises at least two mounting holes spaced for attachment to upper and lower tabs of a low profile I/O panel, and wherein the full height I/O panel of the mounting bracket comprises a pair of tabs presenting respective mounting holes identically positioned to the low profile I/O panel.

12. The information handling system of claim 11 , wherein the at least two mounting holes through the low profile PCBA of the expansion card are identically spaced to at least two holes on a low profile heat sink to enable interchangeability.

13. The information handling system of claim 12 , further comprising a card holder, wherein an unattached peripheral edge of the top mounting panel of the expansion card comprises an embossed surface to frictionally engage the card holder.

14. The information handling system of claim 8 , wherein the full height I/O panel and the top mounting panel of the expansion card comprises a single sheet metal stamping part.

15. A method for providing a full height expansion card, the method comprising:

manufacturing a mounting bracket having (i) a full height input/output (I/O) panel sized for insertion in an I/O panel frame extended across an opening of an enclosure of an information handling system and (ii) a top mounting panel attached to the full height I/O panel and extending orthogonally away from the full height I/O panel;

physically attaching a low profile printed circuit board assembly (PCBA) to at least one of the top mounting panel and the full height I/O panel, wherein the mounting bracket and low profile PCBA define a full height expansion card; and

attaching a full height heat sink to the low profile PCBA, the full height heat sink extending across the top mounting panel, wherein the full height heat sink enables efficient dissipation of heat generated by the low profile PCBA away from one or more functional components of the low profile PCBA.

16. The method of claim 15 , further comprising attaching a mounting plate positioned on a back side of the low profile PCBA by inserting fasteners that pass through respective holes in the low profile PCBA to engage the full height heat sink.

17. The method of claim 15 , further comprising:

attaching, within a battery space, a battery compartment to the mounting panel; and

communicating electrical power from a battery module retained in the battery compartment to a processing component incorporated in the low profile PCBA;

wherein the processing component generates heat, and the heat that is generated by the processing component is dissipated away from the low profiled PCBA via the full height heat sink, which enables faster and more efficient heat dissipation.

18. The method of claim 15 , further comprising interchangeably assembling the low profile PCBA to the mounting bracket and a low profile I/O panel by:

forming a pair of mounting holes in the low profile PCBA spaced for attachment to upper and lower tabs of the low profile I/O panel; and

fastening a pair of tabs on the full height I/O panel to the pair of mounting holes in the low profile PCBA, wherein spacing of the pair of tabs are identically positioned to those on the low profile I/O panel.

19. The method of claim 18 , further comprising interchangeably assembling the low profile PCBA to the mounting bracket and a low profile I/O panel by forming at least two holes in the full heat sink in identical spacing to corresponding at least two holes in the low profile heat sink.

20. The method of claim 15 , further comprising frictionally engaging a card holder to an embossed surface of an unattached peripheral edge of the top mounting panel.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2013
From: LEE, CHIH-HSIANG; LIEN, YAO-CHIEN; WU, HSIEN-CHIH; CHOU, CHIEN HUNG; LIN, KUO-CHIH; HARDIS, MARTIN
To: DELL PRODUCTS L.P.
Reel/Frame 030411/0762 →
Continuity (1)
Related Publication 20140340834A1 · Nov 20, 2014