Semiconductor device and method of making including cap layer and nitride semiconductor layer
To enhance the reliability of the semiconductor device using a nitride semiconductor. A channel layer is formed over a substrate, a barrier layer is formed over the channel layer, a cap layer is formed over the barrier layer, and a gate electrode is formed over the cap layer. In addition, a nitride semiconductor layer is formed in a region where the cap layer over the barrier layer is not formed, and a source electrode and a drain electrode are formed over the nitride semiconductor layer. The cap layer is a p-type semiconductor layer, and the nitride semiconductor layer includes the same type of material as the cap layer and is in an intrinsic state or an n-type state.
1. A semiconductor device having a field effect transistor, comprising:
a substrate;
a channel layer being formed over the substrate and including a nitride semiconductor;
a first nitride semiconductor layer, being an electron supply layer, and being formed over the channel layer and having a larger band gap than the channel layer;
a cap layer formed over the first nitride semiconductor;
a gate electrode formed over the cap layer;
a second nitride semiconductor layer formed in a region which is different from the cap layer, over the first nitride semiconductor layer; and
a source electrode and a drain electrode, formed over the second nitride semiconductor layer, wherein the cap layer is a p-type semiconductor layer, and the second nitride semiconductor layer includes the same type of material as the cap layer, and is in an intrinsic state or an n-type state,
wherein the cap layer includes gallium nitride, and the second nitride semiconductor layer includes gallium nitride, wherein the gallium nitride of the second nitride semiconductor layer is nitrogen poor.
2. The semiconductor device according to claim 1 , wherein the first nitride semiconductor layer is an aluminum gallium nitride layer.