Interface between an integrated circuit and a dielectric waveguide using a carrier substrate with a dipole antenna and a reflector
A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
1. A planar carrier substrate comprising:
a top surface and a bottom surface;
an integrated circuit mount on the top surface;
connection pins on the bottom surface;
vias extending through the substrate between the bottom surface and the top surface for coupling the integrated circuit mount to the connection pins;
an interface surface on the bottom surface;
a reflector structure formed in the carrier substrate opposite the interface surface; and
a dipole antenna coupled to the integrated circuit mount and arranged adjacent the interface surface between the reflector structure and interface surface.
2. The substrate of claim 1 including an integrated circuit mounted on the integrated circuit mount and the integrated circuit having a sub-terahertz signal output coupled to the dipole antenna.
3. The substrate of claim 1 in which the reflector structure is arranged at the top surface.
4. The substrate of claim 1 in which the dipole antenna is arranged at the bottom surface.
5. The substrate of claim 1 in which the reflector structure is spaced from the dipole antenna a distance of approximately one half of a wave length.
6. The substrate of claim 1 in which the reflector structure is spaced from the dipole antenna a distance of approximately an integer and one half of a wave length.
7. The substrate of claim 1 in which the reflector structure is spaced from the dipole antenna a distance in a range of 0.3 to 0.7 or multiples thereof of a wave length.
8. The substrate of claim 1 in which the reflector structure is a metallic plate.
9. A system comprising:
a first planar substrate having a top surface, a bottom surface, an opening between the top and bottom surface, and via pads on the top surface;
a carrier substrate mounted on the top surface of the first substrate, the carrier substrate having a reflector structure formed in the carrier substrate, a top surface and a bottom surface, the top surface having a mount for an integrated circuit, the bottom surface having connection pins coupled to the via pads, and a dipole antenna arranged over the opening between the reflector structure and the opening; and
a solid core dielectric waveguide having a first portion passing through the opening with an interface surface adjacent the dipole antenna, a second portion extending substantially parallel with the first substrate, and an elbow portion between the first portion and the second portion.
10. The system of claim 9 in which the reflector structure is spaced from the dipole antenna a distance of approximately an integer and one half of a wave length.
11. The system of claim 9 in which the reflector structure is spaced from the dipole antenna a distance in a range of 0.3 to 0.7 or multiples thereof of a wave length.
12. The system of claim 9 including an integrated circuit mounted on the carrier substrate on the integrated circuit mount and the integrated circuit having a sub-terahertz signal output coupled to the dipole antenna.
13. The system of claim 9 in which the first planar substrate is a printed circuit board.
14. The system of claim 9 in which the reflector structure is metal.
15. The system of claim 9 in which the reflector structure is planar and extends over the dipole antenna.
16. The system of claim 9 including solder balls coupling the connection pins to the via pads.
17. The system of claim 9 in which the reflector structure is spaced from the dipole antenna a distance of approximately one half of a wave length.