Method of soldering electronic part
A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.
1. A method of soldering an electronic part by two steps of high- and low-temperature soldering in a reflow process employing at least two kinds of solders having different reflow temperatures, characterized in that;
high-temperature soldering as the former step is carried out by employing a solder cream obtained by kneading an Sn—Ag—Cu alloy with a flux, wherein the Sn—Ag—Cu alloy comprises a mixture of a first powder alloy for a high melting point and a second powder alloy for a low melting point,
the first powder alloy comprises 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities,
the second powder alloy comprises smaller compositions (% by weight) of Ag and Cu than the first powder alloy and having a melting point lower than that of the first powder alloy and,
the mixture contains a total of not more than 35% by weight of Ag and Cu,
and further, the total amount of Ag component in the alloy composition of the mixture after melting is more than 10% by weight, and
whereafter low-temperature soldering as the latter step is carried out by employing a solder cream obtained by kneading the second powder alloy with a flux.
2. A method of soldering an electronic part according to claim 1 , characterized in that the second powder alloy contains not more than 4.0% (and more than 0%) by weight of Ag and not more than 2.0% (and more than 0%) by weight of Cu with a balance consisting of Zn and unavoidable impurities.
3. A method of soldering an electronic part according to claim 1 , characterized in that the first powder alloy occupies not less than 50% by weight of the mixture of the first and second powder alloys.
4. A method of soldering an electronic part according to claim 1 , characterized in that the low-temperature soldering as the latter step employs a reflow temperature corresponding to the solid and liquid coexisting region of the first powder alloy.
5. A method of soldering an electronic part by two steps of high- and low-temperature soldering in a reflow process employing at least two kinds of solders having different reflow temperatures, characterized in that;
high-temperature soldering as the former step is carried out by employing a solder cream obtained by kneading an Sn—Ag—Cu alloy with a flux, wherein the Sn—Ag—Cu alloy comprises a mixture of a first powder alloy for a high melting point and a second powder alloy for a low melting point,
the first powder alloy comprises 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities,
the second powder alloy comprises one of not more than 8% (and more than 0%) by weight of Sb, not more than 10% (and more than 0%) by weight of In and not more than 10% (and more than 0%) by weight of Bi, and not more than 4.0% (and more than 0%) by weight of Ag, not more than 2.0% (and more than 0%) by weight of Cu and with a balance consisting of Sn and unavoidable impurities,
the mixture contains a total of not more than 35% by weight of Ag and Cu,
and further, the total amount of Ag component in the alloy composition of the mixture after melting is more than 10% by weight,
whereafter low-temperature soldering as the latter step is carried out by employing a solder cream obtained by kneading the second powder alloy with a flux.
6. A method of soldering an electronic part by two steps of high- and low-temperature soldering in a reflow process employing at least two kinds of solders having different reflow temperatures, characterized in that;
high-temperature soldering as the former step is carried out by employing a solder cream obtained by kneading an Sn—Ag—Cu alloy with a flux, wherein the Sn—Ag—Cu alloy comprises a mixture of a first powder alloy for a high melting point, a second powder alloy for a low melting point and a third powder,
the first powder alloy comprises 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities,
the second powder alloy comprises not more than 4.0% (and more than 0%) by weight of Ag and not more than 2.0% (and more than 0%) by weight of Cu with a balance consisting of Sn and unavoidable impurities,
the third powder is a Cu powder,
the mixture contains a total of not more than 35% by weight of Ag and Cu,
and further, the total amount of Ag component in the alloy composition of the mixture after melting is more than 10% by weight,
whereafter low-temperature soldering as the latter step is carried out by employing a solder cream obtained by kneading the second powder alloy with a flux.
7. A method of soldering an electronic part according to claim 1 , characterized in that the first and/or second powder alloy contains at least one of elements Ni, Fe, Co and Ge added thereto in the amount of not more than 1.0% by weight in the case of Ni, Fe or Co, and in the amount of not more than 0.1% by weight in the case of Ge.
8. A method of soldering an electronic part according to claim 5 , characterized in that the first and/or second powder alloy contains at least one of elements Ni, Fe, Co and Ge added thereto in the amount of not more than 1.0% by weight in the case of Ni, Fe or Co, and in the amount of not more than 0.1% by weight in the case of Ge.
9. A method of soldering an electronic part according to claim 6 , characterized in that the first and/or second powder alloy contains at least one of elements Ni, Fe, Co and Ge added thereto in the amount of not more than 1.0% by weight in the case of Ni, Fe or Co, and in the amount of not more than 0.1% by weight in the case of Ge.