Electronic device with side acoustic emission type speaker device
Disclosed is an electronic device including: a housing having a sound emission hole formed in at least one side thereof; a speaker module which is at least partially accommodated in the housing; and a sound reflection surface formed inside the housing and obliquely facing the speaker module. A sound emitted from the speaker module can be reflected by the sound reflection surface to the sound emission hole. The side acoustic emission type speaker device and the electronic device including the same can be variously implemented.
1. An electronic device comprising:
a housing having a sound emission hole formed in at least one side thereof and a resonance space;
a speaker module that is at least partially disposed in the housing; and
a sound reflection surface formed inside the housing and obliquely facing the speaker module, the sound reflection surface configured to reflect a sound emitted from the speaker module to the sound emission hole,
wherein the sound reflection surface is formed around the resonance space, except in a direction where the sound emission hole is formed inside the resonance space.
2. The electronic device of claim 1 , further comprising:
a first enclosure disposed to face a first surface of the speaker module; and
a sound passage formed in the first enclosure,
wherein the resonance space is enclosed by an inner surface of the first enclosure and the speaker module and the sound passage is connected from the resonance space to the sound emission hole.
3. The electronic device of claim 2 , wherein the sound reflection surface is formed on the inner surface of the first enclosure.
4. The electronic device of claim 2 , further comprising:
a mesh attached to an end of the sound passage on an outer surface of the first enclosure.
5. The electronic device of claim 2 , further comprising:
an opening formed through the housing; and
a second enclosure mounted to face a second surface of the speaker module,
wherein the first enclosure is mounted on the inner surface of the housing to face the opening and the speaker module is disposed in the opening between the first and second enclosures.
6. The electronic device of claim 5 , wherein the second enclosure includes a metal plate that faces the speaker module.
7. The electronic device of claim 2 , further comprising:
a circuit board mounted to face the second surface of the speaker module inside the housing; and
a sealing member interposed between the first enclosure and the circuit board,
wherein the sealing member is disposed around the speaker module.
8. The electronic device of claim 7 , wherein the first enclosure is formed to be integrated with the housing.
9. The electronic device of claim 1 , further comprising:
an enclosure case that defines the resonance space that surrounds a circumference of the speaker module, which is seated on an inner surface of the enclosure case,
wherein the sound reflection surface is formed on the inner surface of the enclosure case.
10. The electronic device of claim 9 , wherein the enclosure case includes a lower enclosure case part on which the speaker module is seated, and an upper enclosure case part coupled to face the lower enclosure case part, and
the sound reflection surface is formed on an inner surface of the upper enclosure case part.
11. A method comprising:
emitting a sound from a speaker module that is at least partially disposed in a housing, the housing having a sound emission hole formed in at least one side thereof and a resonance space;
reflecting the sound to the sound emission hole by a sound reflection surface formed inside the housing and obliquely facing the speaker module,
wherein the sound reflection surface is formed around the resonance space, except in a direction where the sound emission hole is formed inside the resonance space.
12. The method of claim 11 , wherein:
a first enclosure is disposed to face a first surface of the speaker module; and
a sound passage is formed in the first enclosure,
wherein the resonance space is enclosed by an inner surface of the first enclosure and the speaker module and the sound passage is connected from the resonance space to the sound emission hole.
13. The method of claim 12 , wherein the sound reflection surface is formed on the inner surface of the first enclosure.
14. The method of claim 12 , wherein a mesh is attached to an end of the sound passage on an outer surface of the first enclosure.
15. The method of claim 12 , wherein an opening is formed through the housing, and
a second enclosure is mounted to face a second surface of the speaker module, and wherein the first enclosure is mounted on the inner surface of the housing to face the opening and the speaker module is disposed in the opening between the first and second enclosures.
16. The method of claim 15 , wherein the second enclosure includes a metal plate that faces the speaker module.
17. The method of claim 12 , wherein a circuit board is mounted to face the second surface of the speaker module inside the housing and a sealing member is interposed between the first enclosure and the circuit board, and wherein the sealing member is disposed around the speaker module.
18. The method of claim 17 , wherein the first enclosure is formed to be integrated with the housing.
19. The method of claim 11 , wherein an enclosure case defines the resonance space that surrounds a circumference of the speaker module, which is seated on an inner surface of the enclosure case, and wherein the sound reflection surface is formed on the inner surface of the enclosure case.
20. The method of claim 19 , wherein the enclosure case includes a lower enclosure case part on which the speaker module is seated, and an upper enclosure case part coupled to face the lower enclosure case part, and
the sound reflection surface is formed on an inner surface of the upper enclosure case part.