Photocurable/thermosetting resin composition
Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.
1. An alkali-developable photocurable/thermosetting resin composition, comprising:
a carboxyl group-containing photosensitive resin;
a photopolymerization initiator;
a block copolymer; and
a thermosetting component,
wherein the carboxyl group-containing photosensitive resin is obtained from a starting material without an epoxy resin, and
the block copolymer is represented by Formula (I):
A-B-A (I),
where each A individually represents a polymer unit having a glass transition temperature, Tg, of 0° C. or higher, and B represents a polymer unit having a glass transition temperature, Tg, of lower than 0° C.
2. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein the thermosetting component comprises an epoxy resin.
3. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein the carboxyl group-containing photosensitive resin comprises no hydroxyl group.
4. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein the carboxyl group-containing photosensitive resin is obtained by a process comprising reacting a resin, which is produced by converting some or all of phenolic hydroxyl groups of a phenol resin to oxyalkyl groups having an alcoholic hydroxyl group, with an α,β-ethylenically unsaturated group-containing monocarboxylic acid, and reacting the resulting reaction product with a polybasic acid anhydride.
5. A photocurable/thermosetting dry film obtained by a process comprising coating and drying the photocurable/thermosetting resin composition according to claim 1 on a carrier film.
6. A cured product obtained by a process comprising curing the photocurable/thermosetting resin composition according to claim 1 by irradiating with an active energy beam, heating, or both.
7. A printed wiring board, comprising:
the cured product according to claim 6 .
8. The alkali-developable photocurable/thermosetting resin composition according to claim 4 , wherein the carboxyl group-containing photosensitive resin is obtained by a process comprising reacting a resin, which is produced by converting all of phenolic hydroxyl groups of a phenol resin to oxyalkyl groups having an alcoholic hydroxyl group, with an α,β-ethylenically unsaturated group-containing monocarboxylic acid, and reacting the resulting reaction product with a polybasic acid anhydride.
9. The alkali-developable photocurable/thermosetting resin composition according to claim 2 , wherein the carboxyl group-containing photosensitive resin comprises no hydroxyl group.
10. The alkali-developable photocurable/thermosetting resin composition according to claim 2 , wherein the carboxyl group-containing photosensitive resin is obtained by a process comprising reacting a resin, which is produced by converting some or all of phenolic hydroxyl groups of a phenol resin to oxyalkyl groups having an alcoholic hydroxyl group, with an α,β-ethylenically unsaturated group-containing monocarboxylic acid, and reacting the resulting reaction product with a polybasic acid anhydride.
11. A photocurable/thermosetting dry film obtained by a process comprising coating and drying the photocurable/thermosetting resin composition according to claim 2 on a carrier film.
12. A cured product obtained by a process comprising curing the photocurable/thermosetting resin composition according to claim 2 by irradiating with an active energy beam, heating, or both.
13. A printed wiring board, comprising:
the cured product according to claim 12 .
14. A cured product obtained by a process comprising curing the photocurable/thermo setting dry film according to claim 5 by irradiating with an active energy beam, heating, or both.
15. A printed wiring board, comprising:
the cured product according to claim 14 .
16. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein each A represents polymethylmethacrylate or polystyrene.
17. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein B represents poly-n-butylacrylate or polybutadiene.
18. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein each A in the block copolymer comprises a unit selected from the group consisting of a styrene unit, a hydroxyl group-containing unit, a carboxyl group-containing unit, an epoxy-containing unit, and an N-substituted acrylamide unit.
19. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein the polymer unit of A has Tg of 50° C. or higher, and the polymer unit of B has Tg of −20° C. or lower.
20. The alkali-developable photocurable/thermosetting resin composition according to claim 1 , wherein the block copolymer is included in an amount of from 1 to 50 parts by mass based on 100 parts by mass of the carboxyl group-containing photosensitive resin.