IP Library › Granted Patent US 9,313,932
Granted Patent B2
US 9,313,932 · App. 14/139,842 · Granted Apr 12, 2016

Electronic control apparatus for vehicle using overmolding and manufacturing method thereof

Inventors: Yeon Chul Choo (Seoul, KR); Sun Jae Yang (Gunpo-si, KR); Chang Ju Kim (Uijeongbu-si, KR); Seung Mok Song (Seongnam-si, KR); Ju Hyung Lee (Suwon-si, KR)
Assignee: HYUNDAI AUTRON CO., LTD.
H05K7/20854G06F1/20H01L21/44H05K5/0034H05K5/06H05K5/065H05K7/20H05K13/0023Y10T29/49146
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,313,932
App. No.
14/139,842
Granted
Apr 12, 2016
Kind
B2
Abstract

The present disclosures provides an electronic control apparatus for a vehicle using overmolding in which a heat radiating plate is attached to an opposite side of a part requiring heat radiation in a printed circuit board (PCB) and a part other than the part, to which the heat radiating plate is attached, is overmolded so as to directly discharge heat to the air through the heat radiating plate such that a heat radiation effect is excellent, the heat radiating plate is attached in advance and then a housing is formed of mold resin such that a manufacturing process is simplified, and a printed circuit board (PCB) is surrounded by mold resin such that a waterproof function is excellent, and a manufacturing method thereof.

Claims (16)

1. An electronic control apparatus for a vehicle, comprising:

a printed circuit board (PCB) including an electronic control substrate configured to electrically control the electronic control apparatus of the vehicle;

at least one heating element positioned on a surface of the electronic control substrate;

at least one heat radiating plate having a size corresponding to a size of the at least one heating element positioned on an opposite side of the surface of the electronic control substrate where the at least one heating element is positioned;

a connector including a connector pin, and coupled to the PCB; and

an overmold housing configured to overmold the at least one heating element, the PCB, and an outer portion of the at least one heat radiating plate with mold resin such that heat generated from the at least one heating element is directly discharged to air through the at least one heat radiating plate positioned on the opposite side of the surface of the electronic control substrate where the at least one heating element is positioned.

2. The electronic control apparatus of claim 1 , wherein the at least one heat radiating plate is formed of a metal material or is a pad type plate.

3. The electronic control apparatus of claim 1 , wherein the overmold housing is injection-molded in a state of being maintained at a temperature and pressure equal to or lower than a predetermined failure threshold temperature and pressure of the electronic control substrate or the at least one heating element.

4. A method of manufacturing an electronic control apparatus for a vehicle, comprising:

coupling a printed circuit board (PCB) including an electronic control substrate configured to electrically controlling the electronic control apparatus of the vehicle and at least one heating element positioned on a surface of the electronic control substrate to a connector including a connector pin;

attaching at least one heat radiating plate onto an opposite side of the surface of the electronic control substrate where the at least one heating element is positioned;

inserting the PCB, to which the at least one heat radiating plate is attached, into upper and lower molds;

injecting mold resin; and

overmolding the at least one heating element, the PCB, and an outer portion of the at least one heating radiating plate such that heat generated from the at least one heating element is directly discharged to air through the at least one heat radiating plate positioned on the opposite side of the surface of the electronic control substrate where the at least one heating element is positioned,

wherein the at least one heat radiating plate has a size corresponding to a size of the at least one heating element.

5. The method of claim 4 , wherein the overmolding includes injection-molding the PCB, to which the at least one heat radiating plate is attached, in a state where inner sides of the molds are maintained at a temperature and pressure equal to or lower than a predetermined failure threshold temperature and pressure of the electronic control substrate or the at least one heating element.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2021
From: HYUNDAI AUTRON CO., LTD.
To: HYUNDAI KEFICO CORPORATION
Reel/Frame 055092/0734 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 24, 2013
From: CHOO, YEON CHUL; YANG, SUN JAE; KIM, CHANG JU; SONG, SEUNG MOK; LEE, JU HYUNG
To: HYUNDAI AUTRON CO., LTD.
Reel/Frame 031846/0216 →
Priority Claims (1)
KR 10-2013-0043500 · Apr 19, 2013 · national
Continuity (1)
Related Publication 20140313675A1 · Oct 23, 2014