Electronic circuit module component
One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.
1. An electronic circuit module component comprising:
an electronic component comprising an element body; and
a board joined to the electronic component with solder,
the element body comprising:
a first end surface and a second end face at two opposite ends, respectively, in a direction of the electronic component, the direction being parallel with the board;
a mounting surface that opposes the board and connects the first end face and the second end face;
an top surface that is on an opposite side of the mounting surface and connects the first end face and the second end face; and
a first lateral face and a second lateral face substantially parallel with each other and each connecting the mounting surface, the top surface, the first end face and the second end face, and
the electronic component comprising:
a first terminal electrode having a first end part formed on the first end face, a first part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the first end face, and a first mounting part formed on a portion of the mounting surface that is adjacent to the first end face,
a second terminal electrode having a second end part formed on the second end face, a second side part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the second end face, second end face, and a second mounting part formed on a portion of the mounting surface that is adjacent to the second end face; and
an oxide film covering the entire surface of the first end part and the entire surface of the first side part, the oxide film being obtained by oxidizing surfaces of the first and second terminal electrodes;
wherein the first mounting part and the second mounting part are joined to the board with the solder.
2. An electronic circuit module component according to claim 1 , wherein L1<L2, where L1 is a thickness of the oxide film at the first end part or the second end part, and L2 is a distance, as seen in a direction perpendicular to the mounting surface, from an outer surface of the oxide film at the first end part or the second end part to a boundary between the solder adjacent to the first end part or the second end part and the oxide film at the first end part or the second end part.
3. An electronic circuit module component according to claim 1 , wherein the oxidizing is forced oxidizing.
4. An electronic circuit module component according to claim 1 , wherein:
the first terminal electrode and second terminal electrode each has a top part formed on the top surface; and
a metal layer is formed on the top part of the first terminal electrode and the second terminal electrode.
5. An electric circuit module component according to claim 1 , further comprising another oxide film covering the entire surface of the second end part and the entire surface of the second side part.
6. An electronic circuit module component comprising:
an electronic component comprising an element body; and
a board joined to the electronic component with solder,
the element body comprising:
a first end surface and a second end face at two opposite ends, respectively, in a direction of the electronic component, the direction being parallel with the board;
a mounting surface that opposes the board and connects the first end face and the second end face;
an top surface that is on an opposite side of the mounting surface and connects the first end face and the second end face; and
a first lateral face and a second lateral face substantially parallel with each other and each connecting the mounting surface, the top surface, the first end face and the second end face, and
the electronic component comprising:
a first terminal electrode having a first end formed on the first end face, a first side part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the first end face, and a first mounting part formed on a portion of the mounting surface that is adjacent to the first end face, and
a second terminal electrode having a second end part formed on the second end face, a second side part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the second end face, second end face, and a second mounting part formed on a portion of the mounting surface that is adjacent to the second end face; and
an oxide film covering the entire surface of the first end part, the entire surface of the second end part, the entire surface of the first side part, and the entire surface of the second side part, the oxide film including a metal that is a same metal contained in the surface of the side face part,
wherein the first mounting part and the second mounting part are joined to the board with the solder.
7. An electronic circuit module component according to claim 5 , wherein L<L2, where L1 is a thickness of the oxide film at the first end part or the second end part, and L2 is a distance, as seen in a direction perpendicular to the mounting surface, from an outer surface of the oxide film at the first end part or the second end part to a boundary between the solder adjacent to the first end part or the second end part and the oxide film at the first end part or the second end part.
8. An electronic circuit module component according to claim 6 , wherein:
the first terminal electrode and second terminal electrode each has a top part formed on the top surface; and
a metal layer is formed on the top part of the first terminal electrode and the second terminal electrode.
9. An electric circuit module component according to claim 6 , further comprising another oxide film covering the entire surface of the second end part and the entire surface of the second side part.