Circuit and system for concurrently programming multiple bits of OTP memory devices

1. An One-Time Programmable (OTP) memory capable of multiple-bit programming, comprising:

a plurality of OTP cells, at least one of the OTP cells including an electrical fuse element coupled to a program selector, the program selector having a control terminal;

a plurality of local wordlines, each coupled to a plurality of the OTP cells via the control terminal of the program selector and having a first resistivity;

a plurality of global wordlines, each coupled to at least one of the local wordlines and having a second resistivity; and

a plurality of banks of bitlines, each bitline coupled to a plurality of the OTP cells;

a plurality of bank selects to enable turning on the wordlines or bitlines in a bank; and

wherein a plurality of OTP cells can be configured to be concurrently programmable by applying at least one voltage to at least one wordline and at least one bitline in a plurality of banks if a plurality of the bank selects are asserted.

2. An OTP memory as recited in claim 1 , wherein the electrical fuse element is at least one of an interconnect, a conductive contact or via, or combination thereof.

3. An OTP memory as recited in claim 2 , wherein the electrical fuse element has at least one of polysilicon, silicided polysilicon, silicide, polymetal, local interconnect, metal-0, thermally insulated active region, metal, or metal alloy, CMOS gate, or combination thereof.

4. An OTP memory as recited in claim 1 , wherein the at least one of the bank selects is driven from an I/O port that also serves as a data output port during read.

5. An OTP memory as recited in claim 1 , wherein the at least one of the bank select is latched from an I/O port that also serves as a data output port during read.

6. An OTP memory as recited in claim 1 , wherein the program selector is at least one MOS device with the MOS gate as the control terminal.

7. An OTP memory as recited in claim 1 , wherein the program selector comprises at least one diode having at least a first active region with a first type of dopant to provide a first terminal of the diode, and a second active region with a second type of dopant to provide a second terminal of the diode, both active regions being fabricated from sources or drains of CMOS devices and residing in a common CMOS well, the first terminal of the diode coupled to a first terminal of the electrical fuse element, and the second terminal of the diode is the control terminal.

8. An OTP memory as recited in claim 1 , wherein the local wordline is at least partially formed from at least one CMOS well.

9. An OTP memory as recited in claim 1 , wherein the global wordline is constructed of metal.

10. An OTP memory as recited in claim 1 , wherein the global wordline is coupled to the local wordline through at least one of conductive via or contact.

11. An OTP memory as recited in claim 1 , wherein the OTP memory further comprises:

a plurality of write bitline selectors to select at least one of the bitlines coupled to a first supply voltage line; and

a plurality of wordline drivers to select at least one of the local wordlines coupled to a second supply voltage line to conduct currents through a plurality of the OTP cells during programming.

12. An One-Time Programmable (OTP) memory capable of concurrent multi-bit programming, comprising:

a plurality of OTP cells, each of the OTP cells including (i) an electrical fuse element as an OTP element, and (ii) a diode as program selector having at least a first active region with a first type of dopant to provide a first terminal of the diode, and a second active region with a second type of dopant to provide a second terminal of the diode, both active regions being fabricated from sources or drains of CMOS devices and residing in a common CMOS well, the first terminal of the diode coupled to a first terminal of the OTP element;

a plurality of local wordlines, each coupled to a plurality of the OTP cells via the second terminal of the diodes;

a plurality of global wordlines, each coupled to at least one of the local wordlines; and

a plurality of bitlines arranged in banks, each bitline coupled to a plurality of the OTP cells via a second terminal of the OTP element; and.

wherein a plurality of OTP elements being configured to be concurrently programmable by applying at least one voltage to at least one wordline and at least one bitline coupled to a plurality of the OTP cells in a plurality of the banks.

13. An OTP memory as recited in claim 12 , wherein the electrical fuse element has at least one of polysilicon, silicided polysilicon, silicide, polymetal, local interconnect, metal-0, thermally insulated active region, metal, or metal alloy, CMOS gate, or combination thereof.

14. An OTP memory as recited in claim 12 , wherein the OTP memory further comprises a plurality bank selects that enable turning on the wordlines or bitlines in a bank, and wherein the at least one of the bank selects is driven or latched from an I/O port that also serves as a data output port during read.

15. An OTP memory as recited in claim 12 , wherein the local wordline is at least partially formed of CMOS well and/or the global wordline is constructed of metal.

16. An electronics system, comprising:

a processor; and

at least one multiple-bit concurrently programmable OTP memory operatively connected to the processor, the OTP memory comprising:

a plurality of OTP cells, each including an electrical fuse element coupled to a program selector, the program selector having a control terminal;

a plurality of local wordlines, each coupled to a plurality of the OTP cells via the control terminal of the program selector;

a plurality of global wordlines, each coupled to at least one of the local wordlines; and

a plurality of bitlines arranged in banks, each bitline coupled to a plurality of OTP cells in a bank;

a plurality of bank selects to enable turning on the wordlines or bitlines in a bank; and

wherein a plurality of OTP cells can be configured to be concurrently programmable by applying at least one voltage to at least one wordline and at least one bitline in a plurality of the banks if a plurality of the bank selects corresponding to the plurality of the banks are asserted.

17. A method for operating a programmable OTP memory, comprising:

providing a plurality of OTP cells, each including an electrical fuse element coupled to a program selector, the program selector having a control terminal;

providing a plurality of local wordlines, each coupled to a plurality of the OTP cells via the control terminal of the program selector;

providing a plurality of global wordlines, each coupled to at least one of the local wordlines;

providing a plurality bitlines arranged in banks, each bitline coupled to a plurality of the OTP cells; and

concurrently programming a plurality of selected OTP cells into a different logic state by applying voltages to at least one selected global wordlines and at least one selected bitlines in a plurality of the banks to conduct currents and change the resistance of the selected OTP cells.

18. A memory as recited in claim 17 , wherein the electrical fuse element is at least one of an interconnect, a conductive contact or via, or combination thereof.

19. A memory as recited in claim 17 , wherein the electrical fuse element has at least one of polysilicon, silicided polysilicon, silicide, polymetal, local interconnect, metal-0, thermally insulated active region, metal, or metal alloy, CMOS gate, or combination thereof.

20. A memory as recited in claim 17 , wherein the at least one of the bank select is driven or latched from the I/O ports sharing with at least one data output port during read.

21. A memory as recited in claim 17 , wherein the program selector is at least one MOS device with the MOS gate as a control terminal.

22. A memory as recited in claim 17 , wherein the program selector is at least one diode having at least a first active region with a first type of dopant to provide a first terminal of the diode, and a second active region with a second type of dopant to provide a second terminal of the diode, both active regions being fabricated from sources or drains of CMOS devices and residing in a common CMOS well, the first terminal of the diode coupled to a first terminal of the electrical fuse element, the second terminal of the diode is a control terminal.