Open source power quad flat no-lead (PQFN) package
According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase, V-phase, and W-phase power switches situated on the PQFN leadframe. A drain of the U-phase power switch is connected to a U-phase output strip of the PQFN leadframe. A source of the U-phase power switch is connected to a U-phase current sense terminal. The U-phase output strip can substantially traverse across the PQFN leadframe. Another U-phase power switch is situated on the PQFN leadframe with a source of the another U-phase power switch connected to the U-phase output strip of the PQFN leadframe. The PQFN leadframe can include a leadframe island within the U-phase output strip. At least one wirebond may be connected to the U-phase output strip.
1. A power quad flat no-lead (PQFN) package comprising:
U-phase, V-phase, and W-phase power switches situated on a leadframe;
said U-phase power switch being the only power switch situated on a U-phase output strip of said leadframe;
a drain of said U-phase power switch being connected to said U-phase output strip of said leadframe;
wherein said U-phase output strip substantially traverses across said leadframe;
a source of said U-phase power switch being connected to a U-phase current sense terminal.
2. The (PQFN) package of claim 1 , wherein a V-phase output strip substantially traverses across said leadframe.
3. The (PQFN) package of claim 1 comprising a first leadframe island within said U-phase output strip.
4. The (PQFN) package of claim 1 comprising at least one wirebond connected to said U-phase output strip.
5. The (PQFN) package of claim 1 comprising another U-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip of said leadframe.
6. The (PQFN) package of claim 1 , comprising at least one wirebond connecting said source of said U-phase power switch to said U-phase current sense terminal.
7. The (PQFN) package of claim 1 , wherein said U-phase power switch is situated on a U-phase output pad of said leadframe.
8. The (PQFN) package of claim 1 comprising a driver integrated circuit (IC) situated on said leadframe and connected to gates of said U-phase, V-phase, and W-phase power switches.
9. The (PQFN) package of claim 1 , wherein said U-phase, V-phase, and W-phase power switches comprise group 111 -V transistors.
10. The (PQFN) package of claim 1 , wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.
11. The (PQFN) package of claim 1 , wherein said PQFN package has a footprint of less than 12 mm by 12 mm.
12. A power quad flat no-lead (PQFN) package comprising:
U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;
said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;
said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;
wherein said U-phase output strip substantially traverses across said leadframe;
sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals.
13. The (PQFN) package of claim 12 , wherein said V-phase output strip substantially traverses across said leadframe.
14. The (PQFN) package of claim 12 comprising a first leadframe island within said U-phase output strip and a second leadframe island within said V-phase output strip.
15. The (PQFN) package of claim 12 , comprising at least one wirebond connecting said source of said V-phase power switch to said V-phase current sense terminal.
16. The (PQFN) package of claim 12 comprising another U-phase power switch and another V-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip and a source of said another V-phase power switch connected to said V-phase output strip.
17. The (PQFN) package of claim 12 , wherein said U-phase power switch is situated on a U-phase output pad of said leadframe and said V-phase power switch is situated on a V-phase output pad of said leadframe.
18. A power quad flat no-lead (PQFN) package, including a single driver integrated circuit (IC), said PQFN package comprising:
U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;
said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;
said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;
wherein said U-phase output strip substantially traverses across said leadframe;
sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals;
said single driver IC situated on a driver IC pad of said leadframe, said single driver IC being connected to said U-phase output strip and to said V-phase output strip.
19. The (PQFN) package of claim 18 , wherein said V-phase output strip substantially traverses across said leadframe.